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هدرها، پین های نر
| عکس | شماره قطعه تولیدکننده | موجودی | تعداد | برگه مشخصات | سری | بسته بندی | وضعیت محصول | نوع رابط | نوع تماس | زمین - جفت گیری | تعداد موقعیت ها | تعداد ردیف ها | فاصله ردیف - جفت گیری | تعداد موقعیت های بارگذاری شده | سبک | کفن زدن | نوع نصب | فسخ | نوع بست | طول تماس - جفت گیری | طول تماس - پست | طول تماس کلی | ارتفاع عایق | شکل تماس | تماس با پایان - جفت گیری | ضخامت پایان تماس - جفت گیری | تماس با پایان - ارسال | مواد تماس | مواد عایق | ویژگی ها | دمای عملیاتی | رتبه فعلی (آمپر) |
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IPT1-102-01-S-D-PLCONN HEADER VERT 4POS 2.54MM |
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Mini Mate® IPT1 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | 3 | Board to Board | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.155" (3.94mm) | 0.085" (2.16mm) | 0.335" (8.51mm) | 0.250" (6.35mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 2.3A per Contact |
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IPT1-107-03-L-DCONN HEADER VERT 14POS 2.54MM |
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Mini Mate® IPT1 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.155" (3.94mm) | 0.085" (2.16mm) | 0.530" (13.46mm) | 0.445" (11.30mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 2.3A per Contact |
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IPT1-120-01-S-D-FLCONN HEADER VERT 40POS 2.54MM |
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Mini Mate® IPT1 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | All | Board to Board | Shrouded - 4 Wall | Through Hole | Solder | Friction Lock | 0.155" (3.94mm) | 0.085" (2.16mm) | 0.335" (8.51mm) | 0.250" (6.35mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 2.3A per Contact |
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TST-104-01-L-D-LLCONN HEADER VERT 8POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Kinked Pin, Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-105-01-G-D-02CONN HEADER VERT 10POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | 9 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-105-01-T-D-05CONN HEADER VERT 10POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 10 | 2 | 0.100" (2.54mm) | 9 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Tin | - | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 105°C | 3.4A per Contact |
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TST-107-02-T-SCONN HEADER VERT 7POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 7 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.165" (4.19mm) | 0.530" (13.46mm) | 0.350" (8.89mm) | Square | Tin | - | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 105°C | 3.4A per Contact |
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TST-110-01-G-D-LL-01CONN HEADER VERT 20POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | 19 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Kinked Pin, Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-110-04-G-D-RA-01CONN HEADER R/A 20POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | 19 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.250" (6.35mm) | 0.130" (3.30mm) | - | 0.365" (9.27mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-113-04-S-D-RA-06CONN HEADER R/A 26POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 2 | 0.100" (2.54mm) | 25 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.250" (6.35mm) | 0.130" (3.30mm) | - | 0.365" (9.27mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-120-01-L-D-10CONN HEADER VERT 40POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 40 | 2 | 0.100" (2.54mm) | 39 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-130-03-F-SCONN HEADER VERT 30POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.565" (14.35mm) | 0.930" (23.62mm) | 0.350" (8.89mm) | Square | Gold | Flash | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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TST-132-01-G-D-31CONN HEADER VERT 64POS 2.54MM |
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Flex Stack, TST | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 64 | 2 | 0.100" (2.54mm) | 63 | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | -55°C ~ 125°C | 3.4A per Contact |
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MTLW-101-05-G-D-027CONN HEADER THROUGH HOLE 2POS |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | - | 2 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.027" (0.69mm) | 0.248" (6.30mm) | 0.335" (8.51mm) | 0.060" (1.52mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5.2A per Contact |
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MTLW-101-08-G-S-031CONN HEADER THROUGH HOLE 1POS |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | - | 1 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.031" (0.79mm) | 0.439" (11.15mm) | 0.530" (13.46mm) | 0.060" (1.52mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5.2A per Contact |
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MTLW-102-05-F-S-169CONN HEADER VERT 2POS 2.54MM |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.169" (4.30mm) | 0.106" (2.69mm) | 0.335" (8.51mm) | 0.060" (1.52mm) | Square | Gold | 3.00µin (0.076µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5.2A per Contact |
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MTLW-102-05-T-S-050CONN HEADER VERT 2POS 2.54MM |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.050" (1.27mm) | 0.225" (5.72mm) | 0.335" (8.51mm) | 0.060" (1.52mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 5.2A per Contact |
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MTLW-102-05-T-S-061CONN HEADER VERT 2POS 2.54MM |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.061" (1.55mm) | 0.214" (5.44mm) | 0.335" (8.51mm) | 0.060" (1.52mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 5.2A per Contact |
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MTLW-102-07-F-D-280CONN HEADER VERT 4POS 2.54MM |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.280" (7.11mm) | 0.090" (2.29mm) | 0.430" (10.92mm) | 0.060" (1.52mm) | Square | Gold | 3.00µin (0.076µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5.2A per Contact |
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MTLW-102-07-T-S-232CONN HEADER VERT 2POS 2.54MM |
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Flex Stack, MTLW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.232" (5.90mm) | 0.138" (3.50mm) | 0.430" (10.92mm) | 0.060" (1.52mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 5.2A per Contact |
