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EASTECH Electronics

در دسترس ۲۴/۷ در

+86 13632816717
EASTECH Electronics EASTECH Electronics

هدرها، پین های نر

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول نوع رابط نوع تماس زمین - جفت گیری تعداد موقعیت ها تعداد ردیف ها فاصله ردیف - جفت گیری تعداد موقعیت های بارگذاری شده سبک کفن زدن نوع نصب فسخ نوع بست طول تماس - جفت گیری طول تماس - پست طول تماس کلی ارتفاع عایق شکل تماس تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری تماس با پایان - ارسال مواد تماس مواد عایق ویژگی ها دمای عملیاتی رتبه فعلی (آمپر)
SLV W 9 SMD 102 27 Z

SLV W 9 SMD 102 27 Z

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 102 27 Z

برگه مشخصات

SLV W 9 SMD 102 Bulk Active Header Male Pin 0.050" (1.27mm) 27 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 9 SMD 127 17 G

SLV W 9 SMD 127 17 G

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 127 17 G

برگه مشخصات

SLV W 9 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 17 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 9 SMD 127 5 Z

SLV W 9 SMD 127 5 Z

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 127 5 Z

برگه مشخصات

SLV W 9 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 5 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 22 080 58 G

SLV W 22 080 58 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 22 080 58 G

برگه مشخصات

SLV W 22 080 Bulk Active Header Male Pin 0.050" (1.27mm) 58 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.197" (5.00mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 130 6 Z

SLV W 2 130 6 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 130 6 Z

برگه مشخصات

SLV W 2 130 Bulk Active Header Male Pin 0.050" (1.27mm) 6 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 11 SMD 127 72 Z

SLV W 11 SMD 127 72 Z

pitch 1.27 x 2.54 mm; two rows,

Fischer Elektronik

0
RFQ
SLV W 11 SMD 127 72 Z

برگه مشخصات

SLV W 11 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 72 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 SMD 073 12 G

SLV W 2 SMD 073 12 G

pitch 1.27 x 2.54 mm; two rows,

Fischer Elektronik

0
RFQ
SLV W 2 SMD 073 12 G

برگه مشخصات

SLV W 2 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 12 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 KA 030 46 Z

SLV W 2 KA 030 46 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 KA 030 46 Z

برگه مشخصات

SLV W 2 KA 030 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 9 SMD 127 29 G

SLV W 9 SMD 127 29 G

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 127 29 G

برگه مشخصات

SLV W 9 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 29 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 11 105 9 G

SLV W 11 105 9 G

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 11 105 9 G

برگه مشخصات

SLV W 11 105 Bulk Active Header Male Pin 0.050" (1.27mm) 9 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.197" (5.00mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 14 Z

SLV W 3 SMD 048 14 Z

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 14 Z

برگه مشخصات

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 14 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 22 105 28 G

SLV W 22 105 28 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 22 105 28 G

برگه مشخصات

SLV W 22 105 Bulk Active Header Male Pin 0.050" (1.27mm) 28 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.197" (5.00mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 080 34 G

SLV W 2 080 34 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 080 34 G

برگه مشخصات

SLV W 2 080 Bulk Active Header Male Pin 0.050" (1.27mm) 34 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 10 SMD 127 52 Z

SLV W 10 SMD 127 52 Z

0
RFQ
SLV W 10 SMD 127 52 Z

برگه مشخصات

SLV W 10 SMD 127 - Active Header Male Pin 0.050" (1.27mm) 52 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 9 SMD 102 30 G

SLV W 9 SMD 102 30 G

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 102 30 G

برگه مشخصات

SLV W 9 SMD 102 Bulk Active Header Male Pin 0.050" (1.27mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 KA 054 16 G

SLV W 2 KA 054 16 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 KA 054 16 G

برگه مشخصات

SLV W 2 KA 054 Bulk Active Header Male Pin 0.050" (1.27mm) 16 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.213" (5.40mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 105 48 G

SLV W 2 105 48 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 105 48 G

برگه مشخصات

SLV W 2 105 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 9 SMD 127 20 G

SLV W 9 SMD 127 20 G

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 9 SMD 127 20 G

برگه مشخصات

SLV W 9 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 20 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 22 105 36 G

SLV W 22 105 36 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 22 105 36 G

برگه مشخصات

SLV W 22 105 Bulk Active Header Male Pin 0.050" (1.27mm) 36 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.197" (5.00mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 22 055 48 Z

SLV W 22 055 48 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 22 055 48 Z

برگه مشخصات

SLV W 22 055 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.197" (5.00mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A

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