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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول نوع رابط نوع تماس زمین - جفت گیری تعداد موقعیت ها تعداد ردیف ها فاصله ردیف - جفت گیری تعداد موقعیت های بارگذاری شده سبک کفن زدن نوع نصب فسخ نوع بست طول تماس - جفت گیری طول تماس - پست طول تماس کلی ارتفاع عایق شکل تماس تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری تماس با پایان - ارسال مواد تماس مواد عایق ویژگی ها دمای عملیاتی رتبه فعلی (آمپر)
SLV W 10 SMD 127 18 G

SLV W 10 SMD 127 18 G

0
RFQ
SLV W 10 SMD 127 18 G

برگه مشخصات

SLV W 10 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 18 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 SMD 073 20 Z

SLV W 1 SMD 073 20 Z

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 1 SMD 073 20 Z

برگه مشخصات

SLV W 1 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 20 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 10 SMD 127 60 Z

SLV W 10 SMD 127 60 Z

0
RFQ
SLV W 10 SMD 127 60 Z

برگه مشخصات

SLV W 10 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 60 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 036 20 G

SLV W 2 036 20 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 036 20 G

برگه مشخصات

SLV W 2 036 Bulk Active Header Male Pin 0.050" (1.27mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 055 46 G

SLV W 2 055 46 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 055 46 G

برگه مشخصات

SLV W 2 055 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 130 60 G

SLV W 2 130 60 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 130 60 G

برگه مشخصات

SLV W 2 130 Bulk Active Header Male Pin 0.050" (1.27mm) 60 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 SMD 048 5 G

SLV W 1 SMD 048 5 G

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 1 SMD 048 5 G

برگه مشخصات

SLV W 1 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 5 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 KA 055 31 Z

SLV W 1 KA 055 31 Z

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 1 KA 055 31 Z

برگه مشخصات

SLV W 1 KA 055 Bulk Active Header Male Pin 0.050" (1.27mm) 31 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 105 46 G

SLV W 2 105 46 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 105 46 G

برگه مشخصات

SLV W 2 105 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 KA 055 28 G

SLV W 1 KA 055 28 G

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 1 KA 055 28 G

برگه مشخصات

SLV W 1 KA 055 Bulk Active Header Male Pin 0.050" (1.27mm) 28 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 11 055 31 G

SLV W 11 055 31 G

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 11 055 31 G

برگه مشخصات

SLV W 11 055 Bulk Active Header Male Pin 0.050" (1.27mm) 31 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.197" (5.00mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 080 14 Z

SLV W 2 080 14 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 080 14 Z

برگه مشخصات

SLV W 2 080 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 10 SMD 127 38 Z

SLV W 10 SMD 127 38 Z

0
RFQ
SLV W 10 SMD 127 38 Z

برگه مشخصات

SLV W 10 SMD 127 Bulk Active Header Male Pin 0.050" (1.27mm) 38 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 SMD 073 18 Z

SLV W 1 SMD 073 18 Z

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 1 SMD 073 18 Z

برگه مشخصات

SLV W 1 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 18 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 KA 030 6 G

SLV W 1 KA 030 6 G

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 1 KA 030 6 G

برگه مشخصات

SLV W 1 KA 030 Bulk Active Header Male Pin 0.050" (1.27mm) 6 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 10 SMD 102 40 Z

SLV W 10 SMD 102 40 Z

0
RFQ
SLV W 10 SMD 102 40 Z

برگه مشخصات

SLV W 10 SMD 102 Bulk Active Header Male Pin 0.050" (1.27mm) 40 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.118" (3.00mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 036 14 Z

SLV W 2 036 14 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 036 14 Z

برگه مشخصات

SLV W 2 036 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 2 036 70 G

SLV W 2 036 70 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0
RFQ
SLV W 2 036 70 G

برگه مشخصات

SLV W 2 036 Bulk Active Header Male Pin 0.050" (1.27mm) 70 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 080 27 Z

SLV W 1 080 27 Z

suitable for female header BLM

Fischer Elektronik

0
RFQ
SLV W 1 080 27 Z

برگه مشخصات

SLV W 1 080 Bulk Active Header Male Pin 0.050" (1.27mm) 27 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 1 SMD 048 6 Z

SLV W 1 SMD 048 6 Z

one row, wide isolation body, 4-

Fischer Elektronik

0
RFQ
SLV W 1 SMD 048 6 Z

برگه مشخصات

SLV W 1 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 6 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A

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