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EASTECH Electronics

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EASTECH Electronics EASTECH Electronics

هدرها، پین های نر

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول نوع رابط نوع تماس زمین - جفت گیری تعداد موقعیت ها تعداد ردیف ها فاصله ردیف - جفت گیری تعداد موقعیت های بارگذاری شده سبک کفن زدن نوع نصب فسخ نوع بست طول تماس - جفت گیری طول تماس - پست طول تماس کلی ارتفاع عایق شکل تماس تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری تماس با پایان - ارسال مواد تماس مواد عایق ویژگی ها دمای عملیاتی رتبه فعلی (آمپر)
SLV W 3 SMD 073 20 Z

SLV W 3 SMD 073 20 Z

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 20 Z

برگه مشخصات

SLV W 3 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 20 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 2 G SM

SLV W 3 SMD 048 2 G SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 2 G SM

برگه مشخصات

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 2 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 105 14 G

SLV W 4 105 14 G

0
RFQ
SLV W 4 105 14 G

برگه مشخصات

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 080 64 G

SLV W 4 080 64 G

0
RFQ
SLV W 4 080 64 G

برگه مشخصات

SLV W 4 080 Bulk Active Header Male Pin 0.050" (1.27mm) 64 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 055 72 G

SLV W 4 055 72 G

0
RFQ
SLV W 4 055 72 G

برگه مشخصات

SLV W 4 055 Bulk Active Header Male Pin 0.050" (1.27mm) 72 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 080 16 Z

SLV W 4 080 16 Z

0
RFQ
SLV W 4 080 16 Z

برگه مشخصات

SLV W 4 080 Bulk Active Header Male Pin 0.050" (1.27mm) 16 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 036 24 Z

SLV W 4 036 24 Z

0
RFQ
SLV W 4 036 24 Z

برگه مشخصات

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 24 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 073 19 Z SM

SLV W 3 SMD 073 19 Z SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 19 Z SM

برگه مشخصات

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 19 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 036 18 Z

SLV W 4 036 18 Z

0
RFQ
SLV W 4 036 18 Z

برگه مشخصات

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 18 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 105 42 Z

SLV W 4 105 42 Z

0
RFQ
SLV W 4 105 42 Z

برگه مشخصات

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 42 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 036 54 G

SLV W 4 036 54 G

0
RFQ
SLV W 4 036 54 G

برگه مشخصات

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 54 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 SMD 073 14 Z

SLV W 4 SMD 073 14 Z

0
RFQ
SLV W 4 SMD 073 14 Z

برگه مشخصات

SLV W 4 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 130 46 G

SLV W 4 130 46 G

0
RFQ
SLV W 4 130 46 G

برگه مشخصات

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 105 22 Z

SLV W 4 105 22 Z

0
RFQ
SLV W 4 105 22 Z

برگه مشخصات

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 22 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 073 8 Z SM

SLV W 3 SMD 073 8 Z SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 8 Z SM

برگه مشخصات

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 8 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 055 56 G

SLV W 4 055 56 G

0
RFQ
SLV W 4 055 56 G

برگه مشخصات

SLV W 4 055 Bulk Active Header Male Pin 0.050" (1.27mm) 56 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 29 Z SM

SLV W 3 SMD 048 29 Z SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 29 Z SM

برگه مشخصات

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 29 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 105 52 Z

SLV W 4 105 52 Z

0
RFQ
SLV W 4 105 52 Z

برگه مشخصات

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 52 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 SMD 073 14 G

SLV W 4 SMD 073 14 G

0
RFQ
SLV W 4 SMD 073 14 G

برگه مشخصات

SLV W 4 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 14 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 105 38 G

SLV W 4 105 38 G

0
RFQ
SLV W 4 105 38 G

برگه مشخصات

SLV W 4 105 Bulk Active Header Male Pin 0.050" (1.27mm) 38 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.413" (10.50mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A

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