لطفاً برای دریافت آخرین قیمت‌ها و موجودی با ما تماس بگیرید.
EASTECH Electronics

در دسترس ۲۴/۷ در

+86 13632816717
EASTECH Electronics EASTECH Electronics

هدرها، پین های نر

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول نوع رابط نوع تماس زمین - جفت گیری تعداد موقعیت ها تعداد ردیف ها فاصله ردیف - جفت گیری تعداد موقعیت های بارگذاری شده سبک کفن زدن نوع نصب فسخ نوع بست طول تماس - جفت گیری طول تماس - پست طول تماس کلی ارتفاع عایق شکل تماس تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری تماس با پایان - ارسال مواد تماس مواد عایق ویژگی ها دمای عملیاتی رتبه فعلی (آمپر)
SLV W 3 SMD 073 22 G SM

SLV W 3 SMD 073 22 G SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 22 G SM

برگه مشخصات

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 22 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 SMD 073 18 G

SLV W 4 SMD 073 18 G

0
RFQ
SLV W 4 SMD 073 18 G

برگه مشخصات

SLV W 4 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 18 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 036 68 G

SLV W 4 036 68 G

0
RFQ
SLV W 4 036 68 G

برگه مشخصات

SLV W 4 036 - Active Header Male Pin 0.050" (1.27mm) 68 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 055 48 G

SLV W 4 055 48 G

0
RFQ
SLV W 4 055 48 G

برگه مشخصات

SLV W 4 055 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 130 16 Z

SLV W 4 130 16 Z

0
RFQ
SLV W 4 130 16 Z

برگه مشخصات

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 16 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 073 22 G

SLV W 3 SMD 073 22 G

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 22 G

برگه مشخصات

SLV W 3 SMD 073 Bulk Active Header Male Pin 0.050" (1.27mm) 22 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 SMD 073 16 G B TR

SLV W 4 SMD 073 16 G B TR

0
RFQ
SLV W 4 SMD 073 16 G B TR

برگه مشخصات

SLV W 4 SMD 073 Tape & Reel (TR) Active Header Male Pin 0.050" (1.27mm) 16 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 130 24 Z

SLV W 4 130 24 Z

0
RFQ
SLV W 4 130 24 Z

برگه مشخصات

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 24 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 130 12 G

SLV W 4 130 12 G

0
RFQ
SLV W 4 130 12 G

برگه مشخصات

SLV W 4 130 Bulk Active Header Male Pin 0.050" (1.27mm) 12 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 SMD 048 28 G

SLV W 4 SMD 048 28 G

0
RFQ
SLV W 4 SMD 048 28 G

برگه مشخصات

SLV W 4 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 28 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 5 G SM

SLV W 3 SMD 048 5 G SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 5 G SM

برگه مشخصات

SLV W 3 SMD 048 - Active Header Male Pin 0.050" (1.27mm) 5 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 130 10 G

SLV W 4 130 10 G

0
RFQ
SLV W 4 130 10 G

برگه مشخصات

SLV W 4 130 - Active Header Male Pin 0.050" (1.27mm) 10 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.512" (13.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 080 46 Z

SLV W 4 080 46 Z

0
RFQ
SLV W 4 080 46 Z

برگه مشخصات

SLV W 4 080 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 36 G

SLV W 3 SMD 048 36 G

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 36 G

برگه مشخصات

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 36 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 048 30 G SM

SLV W 3 SMD 048 30 G SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 048 30 G SM

برگه مشخصات

SLV W 3 SMD 048 Bulk Active Header Male Pin 0.050" (1.27mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.189" (4.80mm) 0.118" (3.00mm) 0.374" (9.50mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 3 SMD 073 22 Z SM

SLV W 3 SMD 073 22 Z SM

one row expanded insulator 2-20

Fischer Elektronik

0
RFQ
SLV W 3 SMD 073 22 Z SM

برگه مشخصات

SLV W 3 SMD 073 Tube Active Header Male Pin 0.050" (1.27mm) 22 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.287" (7.30mm) 0.118" (3.00mm) 0.472" (12.00mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 080 24 Z

SLV W 4 080 24 Z

0
RFQ
SLV W 4 080 24 Z

برگه مشخصات

SLV W 4 080 - Active Header Male Pin 0.050" (1.27mm) 24 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 055 32 Z

SLV W 4 055 32 Z

0
RFQ
SLV W 4 055 32 Z

برگه مشخصات

SLV W 4 055 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.217" (5.50mm) 0.098" (2.50mm) 0.382" (9.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 036 30 Z

SLV W 4 036 30 Z

0
RFQ
SLV W 4 036 30 Z

برگه مشخصات

SLV W 4 036 Bulk Active Header Male Pin 0.050" (1.27mm) 30 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) 0.307" (7.80mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 4 080 72 Z

SLV W 4 080 72 Z

0
RFQ
SLV W 4 080 72 Z

برگه مشخصات

SLV W 4 080 - Active Header Male Pin 0.050" (1.27mm) 72 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.315" (8.00mm) 0.098" (2.50mm) 0.480" (12.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A

همین حالا شروع کنید!

دریافت آخرین اخبار

EASTECH Electronics

خانه

EASTECH Electronics

جستجو

EASTECH Electronics

محصولات

EASTECH Electronics

Whatsapp

در حال ارسال...
×
با موفقیت ارسال شد!
از ارسال شما سپاسگزاریم، تیم فروش ما درخواست شما را دریافت خواهد کرد و ظرف ۱۲ ساعت با ارائه قیمت با شما تماس خواهیم گرفت.