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شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	زمین - جفت گیری	تعداد موقعیت ها	تعداد ردیف ها	فاصله ردیف - جفت گیری	تعداد موقعیت های بارگذاری شده	سبک	کفن زدن	نوع نصب	فسخ	نوع بست	طول تماس - جفت گیری	طول تماس - پست	طول تماس کلی	ارتفاع عایق	شکل تماس	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	تماس با پایان - ارسال	مواد تماس	مواد عایق	ویژگی ها	دمای عملیاتی	رتبه فعلی (آمپر)
SLV W 7 092 32 Z TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 7 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 7 092 36 G TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 7 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 8 117 30 Z TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 8 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 8 117 26 Z TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 8 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 6 117 8 Z ONE ROW, 0.4 MMFOR INT Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 6 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 6 117 6 G ONE ROW, 0.4 MMFOR INT Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 6 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 8 092 6 G TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 8 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 7 092 44 Z TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 7 092	Tube	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 7 092 68 Z TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 7 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	68	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 8 092 32 G TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 8 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 8 092 54 G TWO ROWS, 0.4 MM; PITCH 1. Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 8 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	54	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLY 1 081 10 G 0.5 MM, STRAIGHT Fischer Elektronik	-	RFQ	برگه مشخصات	SLY 1 081	Bulk	Active	Header	Male Pin	0.079" (2.00mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.118" (3.00mm)	0.319" (8.10mm)	0.059" (1.50mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	3A
SLV W 4 KA 060 50 Z GRID 1.27 X1.27 MM; SUITABLE FO Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 4 KA 060	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.236" (6.00mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 6 117 25 Z ONE ROW, 0.4 MMFOR INT Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 6 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	25	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 4 KA 060 48 G GRID 1.27 X1.27 MM; SUITABLE FO Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 4 KA 060	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.236" (6.00mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 6 092 28 G ONE ROW, 0.4 MMFOR INT Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 6 092	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLV W 6 117 10 G ONE ROW, 0.4 MMFOR INT Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 6 117	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	10	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Sandwich	-40°C ~ 163°C	1.5A
SLY 1 104 7 Z 0.5 MM, STRAIGHT Fischer Elektronik	-	RFQ	برگه مشخصات	SLY 1 104	Bulk	Active	Header	Male Pin	0.079" (2.00mm)	7	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.232" (5.90mm)	0.118" (3.00mm)	0.409" (10.40mm)	0.059" (1.50mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	3A
SLY 11 SMD 133 34 G ONE ROW, 0.5 MM, SUITABLE FOR Fischer Elektronik	-	RFQ	برگه مشخصات	SLY 11 SMD 133	Tube	Active	Header	Male Pin	0.079" (2.00mm)	34	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.142" (3.60mm)	-	-	0.059" (1.50mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	3A
SLY 11 SMD 051 30 S ONE ROW, 0.5 MM, SUITABLE FOR Fischer Elektronik	-	RFQ	برگه مشخصات	SLY 11 SMD 051	Bulk	Active	Header	Male Pin	0.079" (2.00mm)	30	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.142" (3.60mm)	-	-	0.059" (1.50mm)	Square	Gold	7.87µin (0.200µm)	Tin	Copper Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	3A

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