هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
CLM-137-02-L-D-BE LOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
329-13-161-41-540000 CONN RCPT 61POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	329	Bulk	Active	Receptacle	Female Socket	Board to Board	61	All	0.100" (2.54mm)	1	-	Through Hole	Solder Cup	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.110" (2.79mm)	0.180" (4.57mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	3A	-
CLT-148-02-S-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
399-91-046-21-300000 STANDARD SOCKET HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	399	Bulk	Active	Socket	Female Socket	Board to Board	46	All	0.050" (1.27mm)	1	-	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.118" (3.00mm)	-	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	Block Terminals	3A	-
WT20SAD9 MOTORS & SOLENOIDS AirBorn, Inc.	-	RFQ	برگه مشخصات	W	Bulk	Active	Receptacle	Female Socket	Board to Board	20	All	0.100" (2.54mm)	1	-	Through Hole	Solder	Push-Pull	Gold	-	Gray	0.335" (8.51mm)	0.140" (3.56mm)	-65°C ~ 125°C	-	-	-	-	-	5A	1000V
ESD-125-G-07 CONN SOCKET 50POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	50	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.400" (10.16mm)	0.265" (6.73mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
CLP-133-02-H-D-BE-P LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	66	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Pick and Place	3.3A per Contact	240VAC, 330VDC
YTE-132-02-L-Q-500-001 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	128	127	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.500" (12.70mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
CLT-131-02-H-D-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESQT-136-03-G-Q-310 CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.310" (7.87mm)	0.148" (3.76mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-136-03-G-Q-368 CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.368" (9.35mm)	0.090" (2.29mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-136-03-G-Q-370 CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.370" (9.40mm)	0.088" (2.23mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-136-03-G-Q-408 CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.408" (10.36mm)	0.050" (1.27mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
801-13-056-10-007000 CONN RCPT 56POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	801	Bulk	Active	Receptacle	Female Socket	Board to Board	56	All	0.100" (2.54mm)	1	-	Through Hole	Solder Cup	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.110" (2.79mm)	0.340" (8.64mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A	-
CLT-139-02-SM-D-A-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLM-120-02-H-D-A-P LOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESD-132-T-07 CONN SOCKET 64POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	64	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.400" (10.16mm)	0.265" (6.73mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	-	-
803-83-068-10-216101 CONN SOCKET 68POS 0.1 GOLD PCB Preci-Dip	-	RFQ	برگه مشخصات	803	Bulk	Active	Socket	Female Socket	Board to Board	68	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	29.5µin (0.75µm)	Black	1.476" (37.50mm)	0.118" (3.00mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
CLP-134-02-STL-D-PA LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	68	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	Board Guide, Pick and Place	3.3A per Contact	240VAC, 330VDC
CLP-134-02-STL-D-P LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	68	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	Pick and Place	3.3A per Contact	240VAC, 330VDC