هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
CLT-134-02-H-D-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-143-02-SM-D-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLH-144-H-D-DV CLH-144-H-D-DV Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLP-140-02-H-D-K LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	80	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Pick and Place	3.3A per Contact	240VAC, 330VDC
ESQT-135-02-M-6-375 CONN SOCKET 210P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	210	All	0.079" (2.00mm)	6	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.375" (9.53mm)	0.475" (12.07mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-135-02-M-6-690 CONN SOCKET 210P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	210	All	0.079" (2.00mm)	6	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.690" (17.52mm)	0.160" (4.06mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQ-133-38-G-T CONN SOCKET 99POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESQ	Tube	Active	Elevated Socket	Forked	Board to Board	99	All	0.100" (2.54mm)	3	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.435" (11.05mm)	0.290" (7.37mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	5.7A per Contact	550VAC
FOLC-135-04-S-Q CONN RCPT 140POS 0.05 GOLD PCB Samtec Inc.	-	RFQ	-	FOURRAY™ FOLC	Tube	Active	Receptacle	Female Socket	Board to Board	140	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.180" (4.57mm)	0.120" (3.05mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	2.6A per Contact	-
534974-8 CONN RCPT 150P 0.1 GOLD PCB R/A TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	AMPMODU Mod II	Tube	Active	Receptacle	Female Socket	Board to Board	150	All	0.100" (2.54mm)	3	0.100" (2.54mm)	Through Hole, Right Angle	Solder	Push-Pull	Gold	30.0µin (0.76µm)	-	0.338" (8.59mm)	0.115" (2.92mm)	-	-	Tin-Lead	-	-	Guide Pin Ears	-	-
CLT-144-02-SM-D-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-140-02-SM-D-BE-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
FOLC-135-M1-L-Q CONN RCPT 140P 0.05 GOLD SMD T/H Samtec Inc.	-	RFQ	-	FOURRAY™ FOLC	Tube	Active	Receptacle	Female Socket	Board to Board	140	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount, Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.185" (4.70mm)	0.075" (1.91mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	2.6A per Contact	-
CLT-143-02-H-D-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
YTE-145-03-L-Q-345 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	180	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.345" (8.76mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
CLT-131-02-H-D-BE-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESD-130-G-03 CONN SOCKET 60POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	60	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.300" (7.62mm)	0.153" (3.89mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
ESD-128-G-23 CONN SOCKET 56POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	56	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.300" (7.62mm)	0.115" (2.92mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
CLP-148-02-STL-D LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	96	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3.3A per Contact	240VAC, 330VDC
ESD-126-G-05 CONN SOCKET 52POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	52	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.500" (12.70mm)	0.165" (4.19mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
CLP-137-02-H-D-BE LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	74	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	3.3A per Contact	240VAC, 330VDC