هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
1419700000 CONN RCPT 36POS 0.197 TIN PCB Weidmüller	-	RFQ	برگه مشخصات	Omnimate RSV	Bulk	Active	Receptacle	Female Socket	Board to Board or Cable	36	All	0.197" (5.00mm)	4	0.197" (5.00mm)	Through Hole	Solder	Latch Holder	Tin	-	Gray	0.563" (14.30mm)	0.177" (4.50mm)	-20°C ~ 120°C	UL94 V-0	Tin	-	-	Mounting Flange	-	-
CLT-146-02-H-D-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-147-02-SM-D-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESD-130-G-04 CONN SOCKET 60POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	60	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.400" (10.16mm)	0.253" (6.43mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
CLT-142-02-H-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESD-130-G-23 CONN SOCKET 60POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	60	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.300" (7.62mm)	0.115" (2.92mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
ESQT-150-02-G-Q-355 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.355" (9.02mm)	0.495" (12.57mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-368 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.368" (9.35mm)	0.482" (12.24mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-393 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.393" (9.98mm)	0.457" (11.61mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-400 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.400" (10.16mm)	0.450" (11.43mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-435 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.435" (11.05mm)	0.415" (10.54mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-535 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.535" (13.60mm)	0.315" (8.00mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-577 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.577" (14.66mm)	0.273" (6.93mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-640 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.640" (16.26mm)	0.210" (5.33mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-672 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.672" (17.07mm)	0.178" (4.52mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-700 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.700" (17.78mm)	0.150" (3.81mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-150-02-G-Q-711 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.711" (18.06mm)	0.139" (3.53mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
FOLC-135-L2-S-Q CONN RCPT 140POS 0.05 GOLD SMD Samtec Inc.	-	RFQ	-	FOURRAY™ FOLC	Tube	Active	Receptacle	Female Socket	Board to Board	140	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.178" (4.51mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	2.6A per Contact	-
CLT-146-02-H-D-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
QST-130-02-L-5 2.00 MM POWER PLANE SOCKET STRIP Samtec Inc.	-	RFQ	برگه مشخصات	QST	Tube	Active	Receptacle	Female Socket	Board to Board	150	All	0.079" (2.00mm)	5	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.500" (12.70mm)	0.125" (3.18mm)	-55°C ~ 125°C	-	Tin	-	-	-	-	-