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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
110-99-640-41-001000 CONN IC DIP SOCKET 40POS TINLEAD Mill-Max Manufacturing Corp.	181	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 14-HZW/TN CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	446	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
4601 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	1,308	-	RFQ	برگه مشخصات	-	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
110-43-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	257	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-87-628-41-001151 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	443	-	RFQ	-	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, No Center Bar	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
940-44-032-24-000000 CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp.	3,238	-	RFQ	برگه مشخصات	940	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-316-10-003000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	164	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8), 8 Loaded	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
A-CCS 052-G-T CONN SOCKET PLCC 52POS GOLD Assmann WSW Components	172	-	RFQ	برگه مشخصات	-	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
917-93-108-41-005000 CONN TRANSIST TO-5 8POS GOLD Mill-Max Manufacturing Corp.	151	-	RFQ	برگه مشخصات	917	Tube	Active	Transistor, TO-5	8 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 28-HZL/01-TT CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	9,678	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
8484-21B1-RK-TP CONN SOCKET PLCC 84POS TIN 3M	767	-	RFQ	برگه مشخصات	8400	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
110-47-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	120	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 40-HZL-TT CONN IC DIP SOCKET 40POS TIN Assmann WSW Components	2,702	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
110-43-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	685	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	428	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	304	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	249	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8468-21B1-RK-TR CONN SOCKET PLCC 68POS TIN 3M	469	-	RFQ	برگه مشخصات	8400	Tape & Reel (TR)	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
XR2A-1401-N CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div	251	-	RFQ	برگه مشخصات	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
8484-11B1-RK-TP CONN SOCKET PLCC 84POS TIN 3M	388	-	RFQ	برگه مشخصات	8400	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C

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