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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
05-0503-20

05-0503-20

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0
RFQ
05-0503-20

برگه مشخصات

0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
05-0503-30

05-0503-30

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0
RFQ
05-0503-30

برگه مشخصات

0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
12-0518-00

12-0518-00

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0
RFQ
12-0518-00

برگه مشخصات

518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
17-0518-11

17-0518-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0
RFQ
17-0518-11

برگه مشخصات

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
21-0518-10H

21-0518-10H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0
RFQ
21-0518-10H

برگه مشخصات

518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0508-20

06-0508-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0508-20

برگه مشخصات

508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
06-0508-30

06-0508-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0508-30

برگه مشخصات

508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
06-1508-20

06-1508-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-1508-20

برگه مشخصات

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
06-1508-30

06-1508-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-1508-30

برگه مشخصات

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
116-83-420-41-006101

116-83-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
116-83-420-41-006101

برگه مشخصات

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-328-41-005101

110-83-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
110-83-328-41-005101

برگه مشخصات

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-640-41-001101

115-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-002101

116-87-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
116-87-320-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-308-F-O

ICF-308-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-308-F-O

برگه مشخصات

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-308-F-I

ICF-308-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-308-F-I

برگه مشخصات

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
114-83-424-41-117101

114-83-424-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
114-83-424-41-117101

برگه مشخصات

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0106-T-10

HLS-0106-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0106-T-10

برگه مشخصات

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-318-41-002101

116-87-318-41-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
116-87-318-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-316-41-007101

116-83-316-41-007101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
116-83-316-41-007101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-428-41-005101

110-83-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
110-83-428-41-005101

برگه مشخصات

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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