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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
116-83-316-41-008101

116-83-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
116-83-316-41-008101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0105-T-19

HLS-0105-T-19

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0105-T-19

برگه مشخصات

HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-428-41-018101

116-87-428-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
116-87-428-41-018101

برگه مشخصات

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-316-41-035101

146-83-316-41-035101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
146-83-316-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-316-41-036101

146-83-316-41-036101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0
RFQ
146-83-316-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-NTT

ICO-308-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-308-NTT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
14-6513-10

14-6513-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-6513-10

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-0518-11

18-0518-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0
RFQ
18-0518-11

برگه مشخصات

518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0107-T-2

HLS-0107-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0107-T-2

برگه مشخصات

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-87-432-41-105101

110-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ
110-87-432-41-105101

برگه مشخصات

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-318-T-I-TR

ICF-318-T-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ

-

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-318-T-O-TR

ICF-318-T-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-318-T-O-TR

برگه مشخصات

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICO-314-LTT

ICO-314-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-314-LTT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
122-83-318-41-001101

122-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
122-83-318-41-001101

برگه مشخصات

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-318-41-001101

123-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
123-83-318-41-001101

برگه مشخصات

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-004101

116-87-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
116-87-314-41-004101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-640-41-117101

114-87-640-41-117101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0
RFQ
114-87-640-41-117101

برگه مشخصات

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-640-41-134161

114-87-640-41-134161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0
RFQ
114-87-640-41-134161

برگه مشخصات

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-2513-10H

06-2513-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-2513-10H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-3513-11

12-3513-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
12-3513-11

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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