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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
AR 48 HZL/07-TT

AR 48 HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0
RFQ
AR 48 HZL/07-TT

برگه مشخصات

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
08-3518-11H

08-3518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
08-3518-11H

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-632-41-018101

116-87-632-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ
116-87-632-41-018101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-324-41-002101

116-87-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-87-324-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-648-41-001101

115-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3511-10

18-3511-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0
RFQ
18-3511-10

برگه مشخصات

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0112-TT-11

HLS-0112-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0112-TT-11

برگه مشخصات

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
SIP050-1X30-160B

SIP050-1X30-160B

1X30-160B-SIP SOCKET 30 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X30-160B

برگه مشخصات

SIP050-1x Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
25-0513-10T

25-0513-10T

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0
RFQ
25-0513-10T

برگه مشخصات

0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-0518-11H

12-0518-11H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0
RFQ
12-0518-11H

برگه مشخصات

518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-1518-11H

12-1518-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0
RFQ
12-1518-11H

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-99-648-41-001000

110-99-648-41-001000

CONN IC DIP SOCKET 48POS TINLEAD

Mill-Max Manufacturing Corp.

0
RFQ
110-99-648-41-001000

برگه مشخصات

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-83-324-41-018101

116-83-324-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-83-324-41-018101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-632-41-001101

115-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-636-41-001101

110-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0
RFQ
110-83-636-41-001101

برگه مشخصات

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-432-41-117101

114-83-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0
RFQ
114-83-432-41-117101

برگه مشخصات

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-87-312-10-001101

299-87-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
299-87-312-10-001101

برگه مشخصات

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-428-41-003101

115-83-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
115-83-428-41-003101

برگه مشخصات

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-44-068-24-000000

540-44-068-24-000000

CONN SOCKET PLCC 68POS TIN

Mill-Max Manufacturing Corp.

0
RFQ
540-44-068-24-000000

برگه مشخصات

540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
IC-316-SGT

IC-316-SGT

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

0
RFQ
IC-316-SGT

برگه مشخصات

IC Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
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