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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
13-0518-00

13-0518-00

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0
RFQ
13-0518-00

برگه مشخصات

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
26-0518-10

26-0518-10

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0
RFQ
26-0518-10

برگه مشخصات

518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
299-87-314-10-001101

299-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
299-87-314-10-001101

برگه مشخصات

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-6513-10T

28-6513-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6513-10T

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-4518-11

20-4518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-4518-11

برگه مشخصات

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-0518-10

36-0518-10

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0
RFQ
36-0518-10

برگه مشخصات

518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-1518-10

36-1518-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0
RFQ
36-1518-10

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-6511-10

10-6511-10

SOCKET 10 POS SOLDER TAIL TIN

Aries Electronics

0
RFQ

-

511 - Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICF-624-TM-O-TR

ICF-624-TM-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-624-TM-O-TR

برگه مشخصات

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
110-87-950-41-001101

110-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0
RFQ
110-87-950-41-001101

برگه مشخصات

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0511-10

08-0511-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0
RFQ
08-0511-10

برگه مشخصات

511 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-83-642-41-001101

110-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0
RFQ
110-83-642-41-001101

برگه مشخصات

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
643655-8

643655-8

CONN SOCKET SIP 23POS TIN

TE Connectivity AMP Connectors

0
RFQ
643655-8

برگه مشخصات

Diplomate DL Tray Obsolete SIP 23 (1 x 23) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
116-87-428-41-002101

116-87-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
116-87-428-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 42-HZL/07-TT

AR 42-HZL/07-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-87-324-41-001101

116-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-87-324-41-001101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0108-T-30

HLS-0108-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0108-T-30

برگه مشخصات

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
D0822-01

D0822-01

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

0
RFQ
D0822-01

برگه مشخصات

D0 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
33-0518-10T

33-0518-10T

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0
RFQ
33-0518-10T

برگه مشخصات

518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-87-652-41-005101

117-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0
RFQ
117-87-652-41-005101

برگه مشخصات

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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