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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
38-0518-10

38-0518-10

CONN SOCKET SIP 38POS GOLD

Aries Electronics

0
RFQ
38-0518-10

برگه مشخصات

518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-0518-10T

40-0518-10T

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0
RFQ
40-0518-10T

برگه مشخصات

518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
122-83-624-41-001101

122-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
122-83-624-41-001101

برگه مشخصات

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-624-41-001101

123-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
123-83-624-41-001101

برگه مشخصات

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-314-SST

ICO-314-SST

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

0
RFQ
ICO-314-SST

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0207-TT-10

HLS-0207-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0207-TT-10

برگه مشخصات

HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
ICO-422-STT-L

ICO-422-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-422-STT-L

برگه مشخصات

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-628-41-003101

116-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
116-83-628-41-003101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-0518-10

28-0518-10

CONN SOCKET SIP 28POS GOLD

Aries Electronics

0
RFQ
28-0518-10

برگه مشخصات

518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-1518-10

28-1518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-1518-10

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0208-TT-11

HLS-0208-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0208-TT-11

برگه مشخصات

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
ICA-314-SST-L

ICA-314-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-314-SST-L

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-324-41-012101

116-83-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-83-324-41-012101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-3518-10H

20-3518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-3518-10H

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
1-1437537-1

1-1437537-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0
RFQ
1-1437537-1

برگه مشخصات

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic -55°C ~ 125°C
08-2501-30

08-2501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0
RFQ
08-2501-30

برگه مشخصات

501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-2513-11H

10-2513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-2513-11H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0513-11

17-0513-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0
RFQ
17-0513-11

برگه مشخصات

0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-3518-01

08-3518-01

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
08-3518-01

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-624-STL-I-TR

ICF-624-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-624-STL-I-TR

برگه مشخصات

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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