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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
510-87-085-13-001101

510-87-085-13-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0
RFQ
510-87-085-13-001101

برگه مشخصات

510 Bulk Active PGA 85 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-085-13-081101

510-87-085-13-081101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0
RFQ
510-87-085-13-081101

برگه مشخصات

510 Bulk Active PGA 85 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3518-10M

18-3518-10M

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0
RFQ
18-3518-10M

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-83-324-41-035101

146-83-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-324-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-324-41-036101

146-83-324-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-324-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-424-41-035101

146-83-424-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-424-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-424-41-036101

146-83-424-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-424-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-624-41-035101

146-83-624-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-624-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-624-41-036101

146-83-624-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
146-83-624-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-0508-20

10-0508-20

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0
RFQ
10-0508-20

برگه مشخصات

508 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
10-0508-30

10-0508-30

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0
RFQ
10-0508-30

برگه مشخصات

508 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
10-1508-20

10-1508-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-1508-20

برگه مشخصات

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
10-1508-30

10-1508-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-1508-30

برگه مشخصات

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
16-3518-101

16-3518-101

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0
RFQ
16-3518-101

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0517-90C

11-0517-90C

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0
RFQ
11-0517-90C

برگه مشخصات

0517 Bulk Active SIP 11 (1 x 11) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-308-LGT

ICO-308-LGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

0
RFQ
ICO-308-LGT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
146-87-628-41-036101

146-87-628-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
146-87-628-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-324-41-008101

116-83-324-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-83-324-41-008101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-318-NTT

ICO-318-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-318-NTT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
16-6511-10

16-6511-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0
RFQ
16-6511-10

برگه مشخصات

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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