لطفاً برای دریافت آخرین قیمت‌ها و موجودی با ما تماس بگیرید.

سوکت های آی سی

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
510-87-149-15-003101

510-87-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
510-87-149-15-003101

برگه مشخصات

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-149-15-061101

510-87-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
510-87-149-15-061101

برگه مشخصات

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-149-15-063101

510-87-149-15-063101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
510-87-149-15-063101

برگه مشخصات

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-149-15-064101

510-87-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
510-87-149-15-064101

برگه مشخصات

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-642-41-002101

116-87-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0
RFQ
116-87-642-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-113-31-018000

714-43-113-31-018000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-113-31-018000

برگه مشخصات

714 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-314-ZLGT

ICO-314-ZLGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-314-ZLGT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
14-3518-11H

14-3518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-3518-11H

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-1518-11

32-1518-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-1518-11

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
38-3513-10T

38-3513-10T

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0
RFQ
38-3513-10T

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-C195-11

16-C195-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0
RFQ
16-C195-11

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
16-C280-11

16-C280-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0
RFQ
16-C280-11

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-C212-10

24-C212-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0
RFQ
24-C212-10

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C300-10

24-C300-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0
RFQ
24-C300-10

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-83-089-12-051101

510-83-089-12-051101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

0
RFQ
510-83-089-12-051101

برگه مشخصات

510 Bulk Active PGA 89 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-089-13-082101

510-83-089-13-082101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

0
RFQ
510-83-089-13-082101

برگه مشخصات

510 Bulk Active PGA 89 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-318-SGT-L

ICA-318-SGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-318-SGT-L

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-642-41-012101

116-83-642-41-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0
RFQ
116-83-642-41-012101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ZSGG

ICA-314-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-314-ZSGG

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-640-41-001101

116-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0
RFQ
116-87-640-41-001101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 288289290291292293294295...955Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

EASTECH Electronics

خانه

EASTECH Electronics

جستجو

EASTECH Electronics

محصولات

EASTECH Electronics

Whatsapp

در حال ارسال...
×
با موفقیت ارسال شد!
از ارسال شما سپاسگزاریم، تیم فروش ما درخواست شما را دریافت خواهد کرد و ظرف ۱۲ ساعت با ارائه قیمت با شما تماس خواهیم گرفت.