جستجوی داغ M323R8GA3PB0-CTD 900-13636-0010-000 ARDUINO SHIELD SGPC3_SHTC3 ADG452BRUZ AD8630ARUZ RF50S MT25QU01GBBB8E12-0AUT MT53E256M32D2DS-053 AUT:B GS4981-IDA ICM-20948

در دسترس ۲۴/۷ در

+86 13632816717

خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
317-47-108-41-005000 CONN SOCKET SIP 8POS GOLD Mill-Max Manufacturing Corp.	470	-	RFQ	برگه مشخصات	317	Tube	Active	SIP	8 (1 x 8)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICF-308-T-O CONN IC DIP SOCKET 8POS TIN Samtec Inc.	16	-	RFQ	برگه مشخصات	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
XR2A-0815 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	118	-	RFQ	برگه مشخصات	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
110-47-422-41-001000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	225	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 14-HZL/07-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	2,942	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
115-47-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	440	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,264	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
214-99-314-01-670800 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	356	-	RFQ	برگه مشخصات	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	282	-	RFQ	برگه مشخصات	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-020-24-000000 CONN SOCKET PLCC 20POS TIN Mill-Max Manufacturing Corp.	105	-	RFQ	برگه مشخصات	940	Tube	Active	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-47-314-41-006000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	570	-	RFQ	برگه مشخصات	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	345	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
210-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	308	-	RFQ	برگه مشخصات	210	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	332	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-2513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	338	-	RFQ	برگه مشخصات	Lo-PRO®file, 513	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
317-47-116-41-005000 CONN SOCKET SIP 16POS GOLD Mill-Max Manufacturing Corp.	190	-	RFQ	برگه مشخصات	317	Tube	Active	SIP	16 (1 x 16)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-99-318-01-670800 CONN IC DIP SOCKET 18POS TINLEAD Mill-Max Manufacturing Corp.	390	-	RFQ	برگه مشخصات	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-44-318-01-670800 CONN IC DIP SOCKET 18POS TIN Mill-Max Manufacturing Corp.	362	-	RFQ	برگه مشخصات	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-99-320-01-670800 CONN IC DIP SOCKET 20POS TINLEAD Mill-Max Manufacturing Corp.	789	-	RFQ	برگه مشخصات	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-47-628-41-605000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	242	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

Total 19086 Record«Prev 1... 26 27 28 293031 32 33...955 Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

خانه

جستجو

محصولات

[email protected]

+86 13632816717