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سوکت های آی سی
| عکس | شماره قطعه تولیدکننده | موجودی | تعداد | برگه مشخصات | سری | بسته بندی | وضعیت محصول | تایپ کنید | تعداد موقعیت ها یا پین ها (شبکه) | زمین - جفت گیری | تماس با پایان - جفت گیری | ضخامت پایان تماس - جفت گیری | مواد تماس - جفت گیری | نوع نصب | ویژگی ها | فسخ | زمین - پست | تماس با پایان - ارسال | تماس با ضخامت پایان - پست | تماس با مواد - پست | مصالح مسکن | دمای عملیاتی |
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06-3503-31CONN IC DIP SOCKET 6POS GOLD |
0 |
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برگه مشخصات |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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08-6823-90TCONN IC DIP SOCKET 8POS TIN |
0 |
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برگه مشخصات |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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1-1437540-4CONN IC DIP SOCKET 40POS GOLD |
0 |
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برگه مشخصات |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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28-6518-10HCONN IC DIP SOCKET 28POS GOLD |
0 |
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برگه مشخصات |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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ICA-318-ATT.100" SCREW MACHINE DIP SOCKET |
0 |
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برگه مشخصات |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
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28-3518-10HCONN IC DIP SOCKET 28POS GOLD |
0 |
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برگه مشخصات |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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510-87-156-16-001101CONN SOCKET PGA 156POS GOLD |
0 |
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برگه مشخصات |
510 | Bulk | Active | PGA | 156 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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510-87-156-16-091101CONN SOCKET PGA 156POS GOLD |
0 |
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برگه مشخصات |
510 | Bulk | Active | PGA | 156 (16 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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510-87-160-14-001101CONN SOCKET PGA 160POS GOLD |
0 |
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برگه مشخصات |
510 | Bulk | Active | PGA | 160 (14 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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C9128-00CONN IC DIP SOCKET 28POS GOLD |
0 |
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برگه مشخصات |
Edge-Grip™, C91 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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26-6513-11CONN IC DIP SOCKET 26POS GOLD |
0 |
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برگه مشخصات |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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08-820-90WRCONN IC DIP SOCKET 8POS GOLD |
0 |
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برگه مشخصات |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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APO-316-G-J.100" LOW PROFILE SCREW MACHINE |
0 |
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برگه مشخصات |
APO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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8058-1G23CONN TRANSIST TO-5 3POS GOLD |
0 |
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برگه مشخصات |
8058 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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BU400Z-178-HTCONN IC DIP SOCKET 40POS GOLD |
0 |
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برگه مشخصات |
BU-178HT | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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116-83-636-41-009101CONN IC DIP SOCKET 36POS GOLD |
0 |
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برگه مشخصات |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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22-0513-11HCONN SOCKET SIP 22POS GOLD |
0 |
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برگه مشخصات |
0513 | Bulk | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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28-C212-10CONN IC DIP SOCKET 28POS GOLD |
0 |
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برگه مشخصات |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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28-C300-10CONN IC DIP SOCKET 28POS GOLD |
0 |
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برگه مشخصات |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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ICA-316-ZWGT-3.100" SCREW MACHINE DIP SOCKET |
0 |
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برگه مشخصات |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
