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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
116-83-640-41-007101

116-83-640-41-007101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0
RFQ
116-83-640-41-007101

برگه مشخصات

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-116-31-018000

714-43-116-31-018000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-116-31-018000

برگه مشخصات

714 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-314-ZAGG

ICO-314-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-314-ZAGG

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
20-3518-10E

20-3518-10E

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-3518-10E

برگه مشخصات

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0303-G-18

HLS-0303-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0303-G-18

برگه مشخصات

HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
12-0501-30

12-0501-30

CONN SOCKET SIP 12POS TIN

Aries Electronics

0
RFQ
12-0501-30

برگه مشخصات

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-6501-30

18-6501-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0
RFQ
18-6501-30

برگه مشخصات

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-6513-10H

20-6513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0
RFQ
20-6513-10H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-4820-90C

10-4820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-4820-90C

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-6820-90C

10-6820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-6820-90C

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-6822-90C

10-6822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-6822-90C

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-6823-90C

10-6823-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0
RFQ
10-6823-90C

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0116-G-2

HLS-0116-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0116-G-2

برگه مشخصات

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
32-6518-10H

32-6518-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-6518-10H

برگه مشخصات

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-316-ZLGG

ICO-316-ZLGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-316-ZLGG

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0402-G-12

HLS-0402-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0402-G-12

برگه مشخصات

HLS Bulk Active SIP 8 (4 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-324-ZSGT-L

ICA-324-ZSGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-324-ZSGT-L

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
12-6823-90T

12-6823-90T

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

0
RFQ
12-6823-90T

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
10-6823-90TWR

10-6823-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0
RFQ
10-6823-90TWR

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
18-0517-90C

18-0517-90C

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0
RFQ
18-0517-90C

برگه مشخصات

0517 Bulk Active SIP 18 (1 x 18) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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