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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
16-6503-30 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	503	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
510-87-192-17-081101 CONN SOCKET PGA 192POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	192 (17 x 17)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-648-41-012101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0304-G-32 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	12 (3 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
HLS-0217-TT-11 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	34 (2 x 17)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
HLS-0306-T-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	18 (3 x 6)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
ICO-320-LGT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICO-314-ZSGG-L .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICA-314-ZSGG-L .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	برگه مشخصات	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICA-316-ZSGG .100" SCREW MACHINE DIP SOCKET Samtec Inc.	-	RFQ	برگه مشخصات	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICO-316-ZSGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
214-44-624-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	-	RFQ	-	214	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
214-99-624-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	-	RFQ	-	214	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
16-6511-11WR CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	511	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
10-2822-90TWR CONN IC DIP SOCKET 10POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
ICF-318-SM-O .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	-	RFQ	برگه مشخصات	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
116-87-652-41-001101 CONN IC DIP SOCKET 52POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0305-T-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	15 (3 x 5)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
828-AG11D CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Polyester	-55°C ~ 105°C
28-3518-102 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-