لطفاً برای دریافت آخرین قیمت‌ها و موجودی با ما تماس بگیرید.

سوکت های آی سی

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
ICA-314-WGG-2

ICA-314-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-314-WGG-2

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
40-3513-10

40-3513-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-3513-10

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-83-114-13-001101

510-83-114-13-001101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

0
RFQ
510-83-114-13-001101

برگه مشخصات

510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-114-13-062101

510-83-114-13-062101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

0
RFQ
510-83-114-13-062101

برگه مشخصات

510 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-652-41-035101

146-83-652-41-035101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0
RFQ
146-83-652-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-652-41-036101

146-83-652-41-036101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0
RFQ
146-83-652-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0310-T-2

HLS-0310-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0310-T-2

برگه مشخصات

HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
550-10-037-10-061101

550-10-037-10-061101

PGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-037-10-061101

برگه مشخصات

550 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-316-MGG

ICO-316-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-316-MGG

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
XR2C-2002

XR2C-2002

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

0
RFQ
XR2C-2002

برگه مشخصات

XR2 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
50-9513-10

50-9513-10

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0
RFQ
50-9513-10

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
21-0517-90C

21-0517-90C

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0
RFQ
21-0517-90C

برگه مشخصات

0517 Bulk Active SIP 21 (1 x 21) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-6513-10H

28-6513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6513-10H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-9513-10

32-9513-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-9513-10

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-4518-10H

24-4518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0
RFQ
24-4518-10H

برگه مشخصات

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-318-NGT

ICO-318-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-318-NGT

برگه مشخصات

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
126-41-304-41-001000

126-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
126-41-304-41-001000

برگه مشخصات

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-304-41-001000

126-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
126-91-304-41-001000

برگه مشخصات

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
PGA145H003B1-1521R

PGA145H003B1-1521R

PGA SOCKET 145 CTS

Amphenol ICC (FCI)

0
RFQ
PGA145H003B1-1521R

برگه مشخصات

- - Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
ICF-648-T-O

ICF-648-T-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-648-T-O

برگه مشخصات

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
Total 19086 Record«Prev1... 345346347348349350351352...955Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

EASTECH Electronics

خانه

EASTECH Electronics

جستجو

EASTECH Electronics

محصولات

EASTECH Electronics

Whatsapp

در حال ارسال...
×
با موفقیت ارسال شد!
از ارسال شما سپاسگزاریم، تیم فروش ما درخواست شما را دریافت خواهد کرد و ظرف ۱۲ ساعت با ارائه قیمت با شما تماس خواهیم گرفت.