جستجوی داغ 900-5G192-2551-000 900-5G190-2200-000 900-5G133-2200-000 900-5G132-2500-000 900-5G190-2500-000 900-5G132-2200-000 RF600570 IRS2461SXUMA1 900-5G172-2260-000 FBG20N18BSH

در دسترس ۲۴/۷ در

+86 13632816717

خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
14-822-90TWR CONN IC DIP SOCKET 14POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
14-823-90WR CONN IC DIP SOCKET 14POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
16-820-90WR CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
614-43-304-41-001000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
HLS-0312-TT-30 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	36 (3 x 12)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
612-41-304-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-91-304-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
HLS-0320-TT-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	60 (3 x 20)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
20-822-90E CONN IC DIP SOCKET 20POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
123-91-304-41-001000 SOCKET IC OPEN 3 LVL .300 4POS Mill-Max Manufacturing Corp.	-	RFQ	-	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-41-304-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-83-133-13-001101 CONN SOCKET PGA 133POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	133 (13 x 13)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
510-83-133-13-043101 CONN SOCKET PGA 133POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	133 (13 x 13)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
123-13-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-13-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
16-3503-30 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	503	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
ICF-640-STL-I-TR .100" SURFACE MOUNT SCREW MACHIN Samtec Inc.	-	RFQ	برگه مشخصات	ICF	Tape & Reel (TR)	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
612-93-304-41-001000 SOCKET CARRIER SLDRTL .300 4POS Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
612-43-304-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	612	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
08-2810-90WR CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-