سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
42-6513-11H CONN IC DIP SOCKET 42POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Lo-PRO®file, 513	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-820-90 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
20-820-90TWR CONN IC DIP SOCKET 20POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
20-822-90 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
24-6823-90T CONN IC DIP SOCKET 24POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
20-810-90T CONN IC DIP SOCKET 20POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
22-4820-90C CONN IC DIP SOCKET 22POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
22-6822-90C CONN IC DIP SOCKET 22POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
22-6823-90C CONN IC DIP SOCKET 22POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
714-43-216-31-018000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	714	Bulk	Active	DIP, 0.1" (2.54mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
16-6810-90T CONN IC DIP SOCKET 16POS TIN Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
16-6823-90 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
16-2822-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-2823-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-4820-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-4822-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-6820-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-6822-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
16-6823-90C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
28-0508-20 CONN SOCKET SIP 28POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	SIP	28 (1 x 28)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C