سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
APH-0806-G-H APH-0806-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1306-G-H APH-1306-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
268-5401-50-1102JH CONN SOCKET CLCC 68POS GOLD 3M	-	RFQ	برگه مشخصات	OEM	Bulk	Obsolete	CLCC	68 (4 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
HLS-0120-G-31 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
APA-324-T-B ADAPTER PLUG Samtec Inc.	-	RFQ	برگه مشخصات	APA	Bulk	Active	-	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APO-624-T-B .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	APO	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
06-0511-11 CONN SOCKET SIP 6POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	511	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
116-83-636-41-013101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
24-3551-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	-	RFQ	برگه مشخصات	55	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
APO-320-T-H .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	APO	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
ICO-422-ZMGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	برگه مشخصات	ICO	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
940-44-068-17-400004 CONN SKT PLCC Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	940	Tape & Reel (TR)	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
12-0511-11 CONN SOCKET SIP 12POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	511	Bulk	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
517-87-183-14-091111 CONN SOCKET PGA 183POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	517	Bulk	Active	PGA	183 (14 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
14-C195-20 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	EJECT-A-DIP™	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-C195-30 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	EJECT-A-DIP™	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-C280-30 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	EJECT-A-DIP™	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
346-93-138-41-013000 CONN SOCKET SIP 38POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	346	Bulk	Active	SIP	38 (1 x 38)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
346-43-138-41-013000 CONN SOCKET SIP 38POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	346	Bulk	Active	SIP	38 (1 x 38)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
HLS-0406-T-11 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Bulk	Active	SIP	24 (4 x 6)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C