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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
APO-308-G-B

APO-308-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
APO-308-G-B

برگه مشخصات

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
25-0508-20

25-0508-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0
RFQ
25-0508-20

برگه مشخصات

508 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
25-0508-30

25-0508-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0
RFQ
25-0508-30

برگه مشخصات

508 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
40-3513-11

40-3513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-3513-11

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4508-20

22-4508-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0
RFQ
22-4508-20

برگه مشخصات

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-4508-30

22-4508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0
RFQ
22-4508-30

برگه مشخصات

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6810-90C

14-6810-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-6810-90C

برگه مشخصات

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
836-AG11D

836-AG11D

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

0
RFQ
836-AG11D

برگه مشخصات

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
115-41-306-41-001000

115-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
115-41-306-41-001000

برگه مشخصات

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-306-41-001000

115-91-306-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0
RFQ
115-91-306-41-001000

برگه مشخصات

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6518-11H

32-6518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-6518-11H

برگه مشخصات

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
550-10-056-09-041101

550-10-056-09-041101

PGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-056-09-041101

برگه مشخصات

550 Bulk Active PGA 56 (9 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-C182-11

40-C182-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-C182-11

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C212-11

40-C212-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-C212-11

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-C300-11

40-C300-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-C300-11

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-6513-10H

40-6513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-6513-10H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-628-WGT

ICA-628-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-628-WGT

برگه مشخصات

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-0512-T-H

APH-0512-T-H

APH-0512-T-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1512-T-H

APH-1512-T-H

APH-1512-T-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0612-T-H

APH-0612-T-H

APH-0612-T-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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