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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
APH-0706-G-T

APH-0706-G-T

APH-0706-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1806-G-T

APH-1806-G-T

APH-1806-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
28-516-11S

28-516-11S

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

0
RFQ
28-516-11S

برگه مشخصات

516 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-632-AGT

ICO-632-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-632-AGT

برگه مشخصات

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
612-41-306-41-001000

612-41-306-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-41-306-41-001000

برگه مشخصات

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-306-41-001000

612-91-306-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-91-306-41-001000

برگه مشخصات

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
30-3513-11H

30-3513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0
RFQ
30-3513-11H

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
714-43-137-31-018000

714-43-137-31-018000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-137-31-018000

برگه مشخصات

714 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-432-41-001000

110-99-432-41-001000

CONN IC DIP SOCKET 32POS TINLEAD

Mill-Max Manufacturing Corp.

0
RFQ
110-99-432-41-001000

برگه مشخصات

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-43-105-41-005000

317-43-105-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0
RFQ
317-43-105-41-005000

برگه مشخصات

317 Bulk Active SIP 5 (1 x 5) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-322-41-003000

115-47-322-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0
RFQ
115-47-322-41-003000

برگه مشخصات

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
50-9513-11

50-9513-11

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0
RFQ
50-9513-11

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-C195-21

14-C195-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-C195-21

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-C195-31

14-C195-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-C195-31

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-C280-21

14-C280-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-C280-21

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-C280-31

14-C280-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-C280-31

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
37-PGM10013-10

37-PGM10013-10

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
37-PGM10013-10

برگه مشخصات

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
111-41-318-41-001000

111-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
111-41-318-41-001000

برگه مشخصات

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-233-18-071101

510-83-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip

0
RFQ
510-83-233-18-071101

برگه مشخصات

510 Bulk Active PGA 233 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-ZMGG

ICO-632-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-632-ZMGG

برگه مشخصات

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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