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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
124-43-310-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	124	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-91-640-41-003000 SOCKET IC OPEN LOWPRO .600 40POS Mill-Max Manufacturing Corp.	-	RFQ	-	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Thermoplastic	-55°C ~ 125°C
115-41-640-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
114-47-640-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	114	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
26-6820-90C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
26-6822-90C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
26-6823-90C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
26-820-90C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
26-822-90C CONN IC DIP SOCKET 26POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	26 (2 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
510-83-257-20-111101 CONN SOCKET PGA 257POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	257 (20 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
117-47-428-41-005000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	117	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-13-310-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-41-316-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-91-316-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	614	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-91-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-41-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
HLS-0217-G-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	34 (2 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
HLS-0214-G-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
APO-632-T-A1 .100" LOW PROFILE SCREW MACHINE Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8060-1G6 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	8060	Bulk	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C