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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
346-43-161-41-013000

346-43-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
346-43-161-41-013000

برگه مشخصات

346 Bulk Active SIP 61 (1 x 61) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-316-41-780000

104-13-316-41-780000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
104-13-316-41-780000

برگه مشخصات

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
HLS-0313-G-22

HLS-0313-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0313-G-22

برگه مشخصات

HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0312-G-11

HLS-0312-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0312-G-11

برگه مشخصات

HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-83-280-19-081101

510-83-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip

0
RFQ
510-83-280-19-081101

برگه مشخصات

510 Bulk Active PGA 280 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-3571-10

24-3571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3571-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3572-10

24-3572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3572-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3573-10

24-3573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3573-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3574-10

24-3574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3574-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6571-10

24-6571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6571-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6572-10

24-6572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6572-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6573-10

24-6573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6573-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
546-87-149-15-063135

546-87-149-15-063135

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
546-87-149-15-063135

برگه مشخصات

546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-149-15-063136

546-87-149-15-063136

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0
RFQ
546-87-149-15-063136

برگه مشخصات

546 Bulk Active PGA 149 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
32-3574-10

32-3574-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ
32-3574-10

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
605-93-322-11-480000

605-93-322-11-480000

SOCKET CARRIER LOWPRO .300 22POS

Mill-Max Manufacturing Corp.

0
RFQ
605-93-322-11-480000

برگه مشخصات

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-93-422-11-480000

605-93-422-11-480000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0
RFQ
605-93-422-11-480000

برگه مشخصات

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-322-11-480000

605-43-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0
RFQ
605-43-322-11-480000

برگه مشخصات

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-422-11-480000

605-43-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0
RFQ
605-43-422-11-480000

برگه مشخصات

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-ZMGG

ICO-640-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-640-ZMGG

برگه مشخصات

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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