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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
XR2T-2021-N CONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div	0	-	RFQ	برگه مشخصات	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Seal Tape	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1625 CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div	0	-	RFQ	برگه مشخصات	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
ICO-316-SGG .100" LOW PROFILE SCREW MACHINE Samtec Inc.	0	-	RFQ	برگه مشخصات	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
XR2A-0802 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	54	-	RFQ	برگه مشخصات	XR2	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
524-AG11D-ES CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	برگه مشخصات	500	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
3-1571551-2 CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	برگه مشخصات	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
528-AG12D CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	81	-	RFQ	برگه مشخصات	500	Tray	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyester	-55°C ~ 105°C
110-13-318-41-801000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	80	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
848-AG10D CONN IC DIP SOCKET 48POS GOLD TE Connectivity AMP Connectors	41	-	RFQ	برگه مشخصات	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Copper Alloy	Polyester	-55°C ~ 105°C
299-93-318-10-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	64	-	RFQ	برگه مشخصات	299	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
299-43-616-10-002000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	84	-	RFQ	برگه مشخصات	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
117-43-652-41-005000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	32	-	RFQ	برگه مشخصات	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2043650006 P&S Conn 6MM CST SMT SOCKET W/1M Molex	15	-	RFQ	برگه مشخصات	*	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
3-1571550-2 CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	برگه مشخصات	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8060-1G9 CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	برگه مشخصات	8060	Bulk	Obsolete	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
2-1437504-6 8060-1G9=GOLD TRANSISTOR SOCKE TE Connectivity AMP Connectors	38	-	RFQ	برگه مشخصات	8060	Bulk	Active	Transistor, TO-5	3 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
110-13-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	86	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2040540-2 CONN SOCKET LGA 1156POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	برگه مشخصات	-	Tray	Active	LGA	1156 (34 x 34)	0.036" (0.91mm)	Gold	Flash	Copper Alloy	Surface Mount	Closed Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-
117-43-664-41-005000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	53	-	RFQ	برگه مشخصات	117	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-324-G-N ADAPTER PLUG Samtec Inc.	0	-	RFQ	برگه مشخصات	APA	Bulk	Active	-	24 (2 x 12)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-

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