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EASTECH Electronicsپیگیری سفارش EASTECH Electronicsحساب من
زبان
    جستجوی داغ ISO5500DWR ATMEGAS128-MD-HP 900-5G190-2270-000 900-5G192-2571-000 900-5G192-2270-000 NANO120SE3AN BF24TFREDUPS M378A1K43CB2-CTD 900-5G132-2240-000 MMF404326
    EASTECH Electronics

    در دسترس ۲۴/۷ در

    +86 13632816717
    EASTECH Electronics EASTECH Electronics
    تمام دسته‌بندی‌ها
    خانه > محصولات  > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

    سوکت های آی سی

    عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
    42-3572-10

    42-3572-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-3572-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3573-10

    42-3573-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-3573-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3574-10

    42-3574-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-3574-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3575-10

    42-3575-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-3575-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6570-10

    42-6570-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6570-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6571-10

    42-6571-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6571-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6572-10

    42-6572-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6572-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6573-10

    42-6573-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6573-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6574-10

    42-6574-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6574-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6575-10

    42-6575-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6575-10

    برگه مشخصات

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    30-0508-21

    30-0508-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 0
    RFQ
    		30-0508-21

    برگه مشخصات

         		508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    30-0508-31

    30-0508-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 0
    RFQ
    		30-0508-31

    برگه مشخصات

         		508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    42-6556-11

    42-6556-11

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 0
    RFQ
    		42-6556-11

    برگه مشخصات

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    32-0501-21

    32-0501-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 0
    RFQ
    		32-0501-21

    برگه مشخصات

         		501 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-0501-31

    32-0501-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 0
    RFQ
    		32-0501-31

    برگه مشخصات

         		501 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-13-328-41-801000

    110-13-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ
    		110-13-328-41-801000

    برگه مشخصات

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-210-61-001000

    115-43-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 0
    RFQ

    -

    		 115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-1508-21

    30-1508-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 0
    RFQ
    		30-1508-21

    برگه مشخصات

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    30-1508-31

    30-1508-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 0
    RFQ
    		30-1508-31

    برگه مشخصات

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    HLS-0407-G-11

    HLS-0407-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 0
    RFQ
    		HLS-0407-G-11

    برگه مشخصات

         		HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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    +86 13632816717
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