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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
116-43-310-61-007000

116-43-310-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-310-61-007000

116-93-310-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
37-0501-21

37-0501-21

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0
RFQ
37-0501-21

برگه مشخصات

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
37-0501-31

37-0501-31

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0
RFQ
37-0501-31

برگه مشخصات

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-81000-610C

40-81000-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-81000-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8300-310C

40-8300-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8300-310C

برگه مشخصات

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8350-610C

40-8350-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8350-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8600-610C

40-8600-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8600-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8620-610C

40-8620-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8620-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8785-310C

40-8785-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8785-310C

برگه مشخصات

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8785-610C

40-8785-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8785-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8800-610C

40-8800-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8800-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-8810-610C

40-8810-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-8810-610C

برگه مشخصات

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
123-11-636-41-001000

123-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-11-636-41-001000

برگه مشخصات

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-304-14-051111

517-83-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0
RFQ
517-83-304-14-051111

برگه مشخصات

517 Bulk Active PGA 304 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-93-164-31-007000

714-93-164-31-007000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-93-164-31-007000

برگه مشخصات

714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-320-G-R

APO-320-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
APO-320-G-R

برگه مشخصات

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1416-G-H

APH-1416-G-H

APH-1416-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1916-G-H

APH-1916-G-H

APH-1916-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0416-G-H

APH-0416-G-H

APH-0416-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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