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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
116-43-624-61-008000

116-43-624-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
44-3551-11

44-3551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-3551-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3552-11

44-3552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-3552-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3553-11

44-3553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-3553-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6551-11

44-6551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-6551-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3554-11

44-3554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-3554-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6554-11

44-6554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-6554-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6508-212

32-6508-212

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-6508-212

برگه مشخصات

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-6508-312

32-6508-312

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-6508-312

برگه مشخصات

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-640-61-008000

116-43-640-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-133-14-071001

510-93-133-14-071001

CONN SOCKET PGA 133POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
510-93-133-14-071001

برگه مشخصات

510 Tube Active PGA 133 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-430-61-005000

117-93-430-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-422-G-H

APO-422-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
38-3503-21

38-3503-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0
RFQ
38-3503-21

برگه مشخصات

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
38-3503-31

38-3503-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0
RFQ
38-3503-31

برگه مشخصات

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0220-G-18

HLS-0220-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0220-G-18

برگه مشخصات

HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
122-13-640-41-801000

122-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
122-13-640-41-801000

برگه مشخصات

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-80-225-18-091101

550-80-225-18-091101

PGA SOLDER TAIL

Preci-Dip

0
RFQ
550-80-225-18-091101

برگه مشخصات

550 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0420-T-2

HLS-0420-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0420-T-2

برگه مشخصات

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
40-0511-11

40-0511-11

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0
RFQ
40-0511-11

برگه مشخصات

511 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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