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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
36-3575-11

36-3575-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0
RFQ
36-3575-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6573-11

36-6573-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0
RFQ
36-6573-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6574-11

36-6574-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0
RFQ
36-6574-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6552-11

44-6552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-6552-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6553-11

44-6553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0
RFQ
44-6553-11

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
550-10-192M16-001152

550-10-192M16-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-192M16-001152

برگه مشخصات

550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
115-43-950-61-001000

115-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
441-PPG21001-10

441-PPG21001-10

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
441-PPG21001-10

برگه مشخصات

- Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
116-43-650-61-001000

116-43-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
322-13-164-41-001000

322-13-164-41-001000

SOCKET 2 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

0
RFQ
322-13-164-41-001000

برگه مشخصات

322 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0512-G-2

HLS-0512-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0512-G-2

برگه مشخصات

HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
110-13-624-61-801000

110-13-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-61-006000

116-93-650-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-258-31-018000

714-43-258-31-018000

CONN IC DIP SOCKET 58POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-258-31-018000

برگه مشخصات

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-964-41-001000

122-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
122-11-964-41-001000

برگه مشخصات

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-628-G-R

APO-628-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
APO-628-G-R

برگه مشخصات

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip

0
RFQ
517-83-411-20-111111

برگه مشخصات

517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0430-G-H

APH-0430-G-H

APH-0430-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1030-G-H

APH-1030-G-H

APH-1030-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0630-G-H

APH-0630-G-H

APH-0630-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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