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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
APH-1928-G-T

APH-1928-G-T

APH-1928-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0228-G-T

APH-0228-G-T

APH-0228-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1128-G-T

APH-1128-G-T

APH-1128-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0328-G-T

APH-0328-G-T

APH-0328-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-43-952-61-007000

116-43-952-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-61-007000

116-93-952-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1926-G-R

APH-1926-G-R

APH-1926-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1426-G-R

APH-1426-G-R

APH-1426-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0326-G-R

APH-0326-G-R

APH-0326-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1726-G-R

APH-1726-G-R

APH-1726-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0226-G-R

APH-0226-G-R

APH-0226-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1226-G-R

APH-1226-G-R

APH-1226-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
HLS-0420-T-12

HLS-0420-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0420-T-12

برگه مشخصات

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-43-648-61-001000

116-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-648-61-001000

116-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-C300-21

40-C300-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-C300-21

برگه مشخصات

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
42-3570-11

42-3570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0
RFQ
42-3570-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3571-11

42-3571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0
RFQ
42-3571-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3572-11

42-3572-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0
RFQ
42-3572-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3573-11

42-3573-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0
RFQ
42-3573-11

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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