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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
69-PLS11031-12

69-PLS11031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
69-PLS11031-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
69-PLS13112-12

69-PLS13112-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
69-PLS13112-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
69-PRS11031-12

69-PRS11031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
69-PRS11031-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
69-PRS11055-12

69-PRS11055-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
69-PRS11055-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
69-PRS13112-12

69-PRS13112-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
69-PRS13112-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-400M20-000106

518-77-400M20-000106

CONN SOCKET PGA 400POS GOLD

Preci-Dip

0
RFQ
518-77-400M20-000106

برگه مشخصات

518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
20-PLS13120-12

20-PLS13120-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
20-PLS13120-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
20-PRS13120-12

20-PRS13120-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
20-PRS13120-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
36-3553-16

36-3553-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-3553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6551-16

36-6551-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-6551-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6552-16

36-6552-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-6552-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6553-16

36-6553-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-6553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
36-3552-16

36-3552-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-3552-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-3554-16

36-3554-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-3554-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6554-16

36-6554-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-6554-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
550-80-361-18-101135

550-80-361-18-101135

PGA SOLDER TAIL

Preci-Dip

0
RFQ
550-80-361-18-101135

برگه مشخصات

550 Bulk Active PGA 361 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
192-PGM17043-10H

192-PGM17043-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
192-PGM17043-10H

برگه مشخصات

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
44-6556-41

44-6556-41

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0
RFQ
44-6556-41

برگه مشخصات

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
546-83-545-17-000147

546-83-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

0
RFQ
546-83-545-17-000147

برگه مشخصات

546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
80-PRS13127-12

80-PRS13127-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
80-PRS13127-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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