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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
34-6511-10 CONN IC DIP SOCKET 34POS TIN Aries Electronics	-	RFQ	برگه مشخصات	511	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
34-6511-11 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	511	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
02-0501-30 CONN SOCKET SIP 2POS TIN Aries Electronics	-	RFQ	برگه مشخصات	501	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
03-0501-21 CONN SOCKET SIP 3POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	501	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
07-7XXXX-10 CONN SOCKET SIP 7POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	7 (1 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
12-7XXXX-10 CONN SOCKET SIP 12POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
20-7XXXX-10 CONN SOCKET SIP 20POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
25-7XXXX-10 CONN SOCKET SIP 25POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	25 (1 x 25)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
33-7XXXX-10 CONN SOCKET SIP 33POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	33 (1 x 33)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
35-7XXXX-10 CONN SOCKET SIP 35POS TIN Aries Electronics	-	RFQ	برگه مشخصات	700 Elevator Strip-Line™	Bulk	Active	SIP	35 (1 x 35)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
1109011 SERIES 513 LO-PRO W/SOLDER TAIL Aries Electronics	-	RFQ	برگه مشخصات	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
4236-118-14 518 OPN FRM COLLET SCKT SLDR TAI Aries Electronics	-	RFQ	برگه مشخصات	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2357-108-12 EJECT-A-DP LCK/EJCT SCKT SLDR TL Aries Electronics	-	RFQ	برگه مشخصات	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
34-6823-90 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	34 (2 x 17)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
1109785 800 VERTISOCKET HORIZONTAL MOUNT Aries Electronics	-	RFQ	برگه مشخصات	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
14-8470-10 CONN IC DIP SOCKET 14POS TIN Aries Electronics	-	RFQ	برگه مشخصات	8	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-28440-10 CONN IC DIP SOCKET 10POS TIN Aries Electronics	-	RFQ	برگه مشخصات	8	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-68500-10 CONN IC DIP SOCKET 18POS TIN Aries Electronics	-	RFQ	برگه مشخصات	8	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
08-8620-210C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	8	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-8300-210C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	8	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C