جستجوی داغ 2101504-1 900-5G132-2540-000 MRFE6VS25GNR1 900-5G133-2250-000 900-5G133-2550-000 900-5G133-2240-000 900-5G195-2250-000 FSI-130-10-LM-D-M-AD-P-TR MBRB1040-TP XC6220B33BPR-G

در دسترس ۲۴/۷ در

+86 13632816717

خانه > محصولات > فن ها، دمنده ها، مدیریت حرارتی > حرارتی > سینک های حرارتی

سینک های حرارتی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	بسته خنک شده	روش پیوست	شکل	طول	عرض	قطر	ارتفاع باله	اتلاف نیرو @ افزایش دما	مقاومت حرارتی @ جریان هوای اجباری	مقاومت حرارتی @ طبیعی	مواد	پایان مواد
625-35AB HEATSINK FOR 25MM BGA Wakefield-Vette	348	-	RFQ	برگه مشخصات	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	13.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-10ABPE HEATSINK TO-220 W/PINS BLK 1" Wakefield-Vette	807	-	RFQ	برگه مشخصات	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 41°C	3.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
288-1ABE HEATSINK FOR TO220 Wakefield-Vette	3,312	-	RFQ	برگه مشخصات	288	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.215" (5.46mm)	4.0W @ 85°C	12.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
HSB32-232318 HEAT SINK, BGA, 23 X 23 X 18 MM, Same Sky (Formerly CUI Devices)	615	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.709" (18.00mm)	5.9W @ 75°C	4.40°C/W @ 200 LFM	12.67°C/W	Aluminum Alloy	Black Anodized
628-25AB HEATSINK FOR 45MM BGA Wakefield-Vette	2,991	-	RFQ	برگه مشخصات	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.250" (6.35mm)	4.5W @ 80°C	7.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
624-35AB HEATSINK FOR 21MM BGA Wakefield-Vette	5,444	-	RFQ	برگه مشخصات	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.350" (8.89mm)	-	15.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
HSB33-272710 HEAT SINK, BGA, 27 X 27 X 10 MM, Same Sky (Formerly CUI Devices)	1,044	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	4.4W @ 75°C	5.30°C/W @ 200 LFM	17.22°C/W	Aluminum Alloy	Black Anodized
657-20ABPNE HEATSINK TO-220 W/PINS BLK 2" Wakefield-Vette	1,000	-	RFQ	برگه مشخصات	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.000" (50.80mm)	6.0W @ 32°C	2.90°C/W @ 200 LFM	-	Aluminum	Black Anodized
659-65AB HEATSINK EXTRUSION 37MM Wakefield-Vette	759	-	RFQ	برگه مشخصات	659	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.450" (36.83mm)	1.450" (36.83mm)	-	0.650" (16.51mm)	2.0W @ 20°C	1.50°C/W @ 600 LFM	-	Aluminum	Black Anodized
624-60AB HEATSINK FOR 21MM BGA Wakefield-Vette	521	-	RFQ	برگه مشخصات	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
625-60AB HEATSINK FOR 25MM BGA Wakefield-Vette	329	-	RFQ	برگه مشخصات	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.600" (15.24mm)	-	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
628-35AB HEATSINK FOR 45MM BGA Wakefield-Vette	1,997	-	RFQ	برگه مشخصات	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
ATS-PCBT1086 HEATSINK TO-220 W/TAB BLACK Advanced Thermal Solutions Inc.	989	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	-	9.50°C/W @ 200 LFM	22.00°C/W	Aluminum	Black Anodized
627-15ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	410	-	RFQ	برگه مشخصات	627	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	1.500" (38.10mm)	6.0W @ 65°C	5.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
626-20ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	186	-	RFQ	برگه مشخصات	626	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.000" (50.80mm)	6.0W @ 55°C	4.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
657-25ABPNE HEATSINK TO-220 W/PINS BLK 2.5" Wakefield-Vette	970	-	RFQ	برگه مشخصات	657	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	2.500" (63.50mm)	6.0W @ 25°C	2.70°C/W @ 200 LFM	-	Aluminum	Black Anodized
655-26AB HEATSINK FOR 40MM BGA Wakefield-Vette	3,946	-	RFQ	برگه مشخصات	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.260" (6.60mm)	5.0W @ 60°C	3.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
677-10ABPE HEATSINK Wakefield-Vette	1,988	-	RFQ	-	677	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247, Multiwatt	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	3.10°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB41-303014P HEAT SINK, BGA, 30 X 30 X 10 MM, Same Sky (Formerly CUI Devices)	410	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.551" (14.00mm)	5.9W @ 75°C	4.30°C/W @ 200 LFM	12.63°C/W	Aluminum Alloy	Black Anodized
HSB39-252509P HEAT SINK, BGA, 25 X 25 X 9 MM, Same Sky (Formerly CUI Devices)	341	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.354" (9.00mm)	4.3W @ 75°C	6.30°C/W @ 200 LFM	17.53°C/W	Aluminum Alloy	Black Anodized