هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
CLP-134-02-SM-D-PA LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	68	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	Board Guide, Pick and Place	3.3A per Contact	240VAC, 330VDC
803-83-056-10-216101 CONN SOCKET 56POS 0.1 GOLD PCB Preci-Dip	-	RFQ	برگه مشخصات	803	Bulk	Active	Socket	Female Socket	Board to Board	56	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	29.5µin (0.75µm)	Black	1.476" (37.50mm)	0.118" (3.00mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
CLT-149-02-LM-D-BE-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-122-02-H-D-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
399-41-045-21-300000 STANDARD SOCKET HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	399	Bulk	Active	Socket	Female Socket	Board to Board	45	All	0.050" (1.27mm)	1	-	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.118" (3.00mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	Block Terminals	3A	-
CLT-133-02-SM-D-BE-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
BCS-126-H-D-DE-BE PASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-144-02-S-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLP-140-02-STL-D LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	80	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3.3A per Contact	240VAC, 330VDC
CLE-175-01-G-DV CONN RCPT 150POS 0.031 GOLD SMD Samtec Inc.	-	RFQ	برگه مشخصات	CLE	Bulk	Active	Receptacle, Pass Through	Female Socket	Board to Board	150	All	0.031" (0.80mm)	2	0.047" (1.20mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.130" (3.30mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	2.7A per Contact	-
YTE-130-03-F-5-375 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	150	All	0.079" (2.00mm)	5	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	3.00µin (0.076µm)	Black	0.375" (9.53mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
YTQ-124-03-L-6 2.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc.	-	RFQ	برگه مشخصات	YTQ	Tube	Active	Socket	Forked	Board to Board	144	All	0.079" (2.00mm)	6	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.250" (6.35mm)	0.208" (5.28mm)	-55°C ~ 125°C	-	Tin	-	-	-	-	-
YTE-130-03-L-Q-368 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	120	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.368" (9.35mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
YTE-120-03-L-6-408 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	120	All	0.079" (2.00mm)	6	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.408" (10.36mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
YTQ-136-03-L-Q 2.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc.	-	RFQ	برگه مشخصات	YTQ	Tube	Active	Socket	Forked	Board to Board	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.250" (6.35mm)	0.208" (5.28mm)	-55°C ~ 125°C	-	Tin	-	-	-	-	-
324-13-158-41-002000 CONN RCPT 58POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	324	Bulk	Active	Receptacle	Female Socket	Board to Board	58	All	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.110" (2.79mm)	0.630" (16.00mm)	-55°C ~ 125°C	-	Gold	-	-	-	3A	-
801-13-050-10-007000 CONN RCPT 50POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	801	Bulk	Active	Receptacle	Female Socket	Board to Board	50	All	0.100" (2.54mm)	1	-	Through Hole	Solder Cup	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.110" (2.79mm)	0.340" (8.64mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A	-
CLT-135-02-S-D-BE-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-149-02-FM-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESQ-126-49-S-T CONN SOCKET 78POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESQ	Bulk	Active	Elevated Socket	Forked	Board to Board	78	All	0.100" (2.54mm)	3	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.535" (13.60mm)	0.380" (9.65mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	5.7A per Contact	550VAC