هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
CLT-143-02-LM-D-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
833-43-090-30-001000 CONN RCPT 90POS 0.079 GOLD SMD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	833	Bulk	Active	Receptacle	Female Socket	Board to Board	90	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.228" (5.80mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
833-93-090-30-001000 CONN RCPT 90POS 0.079 GOLD SMD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	833	Bulk	Active	Receptacle	Female Socket	Board to Board	90	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.228" (5.80mm)	-	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	-	3A	-
CLE-176-01-G-DV-A CONN RCPT 152POS 0.031 GOLD SMD Samtec Inc.	-	RFQ	برگه مشخصات	CLE	Tube	Active	Receptacle, Pass Through	Female Socket	Board to Board	152	All	0.031" (0.80mm)	2	0.047" (1.20mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.130" (3.30mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Board Guide	2.7A per Contact	-
CLT-126-02-H-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ROLC-140-02-S-Q-LC-K-TR .050" FOURRAY QUAD ROW SOCKET ST Samtec Inc.	-	RFQ	برگه مشخصات	FOURRAY™ ROLC	Tape & Reel (TR)	Active	Receptacle	Female Socket	Board to Board	160	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.175" (4.45mm)	-	-55°C ~ 125°C	-	Tin	-	-	Board Lock, Pick and Place	-	-
CLP-134-02-H-D LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle	Female Socket	Board to Board	68	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	3.3A per Contact	240VAC, 330VDC
803-91-098-61-001000 CONN RCPT 98POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	-	803	Bulk	Active	Receptacle	Female Socket	Board to Board	98	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Press-Fit, Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.276" (7.00mm)	0.104" (2.64mm)	-55°C ~ 125°C	UL94 V-0	Tin-Lead	-	-	-	4.5A	-
CLT-137-02-SM-D-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-149-02-S-D-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
311-13-164-61-001000 CONN RCPT 64POS 0.1 GOLD PCB Mill-Max Manufacturing Corp.	-	RFQ	-	311	Tube	Active	Receptacle	Female Socket	Board to Board	64	All	0.100" (2.54mm)	1	-	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.110" (2.79mm)	0.170" (4.32mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	3A	100V, 150VDC
CLP-122-02-H-D-BE-K LOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc.	-	RFQ	-	CLP	-	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	44	All	0.050" (1.27mm)	2	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.084" (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-	Pick and Place	3.3A per Contact	240VAC, 330VDC
CLM-115-02-H-D-BE-A LOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESQT-150-02-L-Q-310 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.310" (7.87mm)	0.540" (13.72mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-368 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.368" (9.35mm)	0.482" (12.24mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-370 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.370" (9.40mm)	0.480" (12.19mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-394 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.394" (10.00mm)	0.456" (11.58mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-400 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.400" (10.16mm)	0.450" (11.43mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-435 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.435" (11.05mm)	0.415" (10.54mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-02-L-Q-500 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.500" (12.70mm)	0.350" (8.89mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-