هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
CLT-135-02-H-D-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESD-129-G-23 CONN SOCKET 58POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	58	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.300" (7.62mm)	0.115" (2.92mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	-	-
CLT-145-02-SM-D-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
FOLC-130-04-L-Q CONN RCPT 120POS 0.05 GOLD PCB Samtec Inc.	-	RFQ	-	FOURRAY™ FOLC	Tube	Active	Receptacle	Female Socket	Board to Board	120	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.180" (4.57mm)	0.120" (3.05mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	2.6A per Contact	-
BCS-132-H-D-PE-BE PASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
803-83-066-10-216101 CONN SOCKET 66POS 0.1 GOLD PCB Preci-Dip	-	RFQ	برگه مشخصات	803	Bulk	Active	Socket	Female Socket	Board to Board	66	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	29.5µin (0.75µm)	Black	1.476" (37.50mm)	0.118" (3.00mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
ROLC-145-02-S-Q-LC-P-TR .050" FOURRAY QUAD ROW SOCKET ST Samtec Inc.	-	RFQ	برگه مشخصات	FOURRAY™ ROLC	Tape & Reel (TR)	Active	Receptacle	Female Socket	Board to Board	180	All	0.050" (1.27mm)	4	0.050" (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.175" (4.45mm)	-	-55°C ~ 125°C	-	Tin	-	-	Board Lock, Pick and Place	-	-
CLT-132-02-H-D-BE-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
YTE-137-03-L-Q-355 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	148	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.355" (9.02mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
ESD-136-T-28 CONN SOCKET 72POS 0.1 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESD	Bulk	Active	Elevated Socket	Female Socket	Board to Board	72	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.300" (7.62mm)	0.365" (9.27mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	-	-
YTE-130-03-M-Q-368-117 2.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc.	-	RFQ	برگه مشخصات	YTE	Tube	Active	Elevated Socket	Forked	Board to Board	120	119	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.368" (9.35mm)	-	-55°C ~ 105°C	-	Tin	-	-	-	-	-
ESQT-150-03-M-Q-310 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	برگه مشخصات	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.310" (7.87mm)	0.148" (3.76mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-340 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.340" (8.64mm)	0.118" (3.00mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-350 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.350" (8.89mm)	0.108" (2.75mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-360 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.360" (9.14mm)	0.098" (2.50mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-365 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.365" (9.27mm)	0.093" (2.35mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-368 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.368" (9.35mm)	0.090" (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
ESQT-150-03-M-Q-385 CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	200	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.385" (9.78mm)	0.073" (1.85mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	4.5A per Contact	-
BCS-125-H-D-HE PASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-148-02-LM-D-BE-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-