هدر، ظرف، سوکت زن

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	سبک	تعداد موقعیت ها	تعداد موقعیت های بارگذاری شده	زمین - جفت گیری	تعداد ردیف ها	فاصله ردیف - جفت گیری	نوع نصب	فسخ	نوع بست	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	رنگ عایق	ارتفاع عایق	طول تماس - پست	دمای عملیاتی	رتبه اشتعال پذیری مواد	تماس با پایان - ارسال	جفت شدن ارتفاعات انباشته	حفاظت از ورود	ویژگی ها	رتبه فعلی (آمپر)	رتبه بندی ولتاژ
MTV1-2SL79 CONN 2POS 0.05 GOLD PCB ITT Cannon, LLC	-	RFQ	برگه مشخصات	MTV	Bulk	Active	-	Female Socket	Board to Cable/Wire	2	All	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Gold	50.0µin (1.27µm)	-	-	-	-55°C ~ 125°C	-	-	-	-	-	3A	-
ESQT-136-02-H-Q-700 FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc.	-	RFQ	برگه مشخصات	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	144	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.700" (17.78mm)	0.150" (3.81mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
CLM-130-02-H-D-BE LOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
PTHF-127-02-G-Q-368 2.00 MM PC/104-PLUS SELF-NESTING Samtec Inc.	-	RFQ	برگه مشخصات	PTHF	Tube	Active	Receptacle	Forked	Board to Board	108	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Press-Fit, Solder	Push-Pull	Gold	15.0µin (0.38µm)	Black	0.368" (9.35mm)	0.482" (12.24mm)	-55°C ~ 125°C	-	-	-	-	-	-	-
833-43-088-20-001000 CONN RCPT 88P 0.079 GOLD PCB R/A Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	833	Bulk	Active	Receptacle	Female Socket	Board to Board	88	All	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole, Right Angle	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.157" (4.00mm)	0.140" (3.56mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	3A	-
CLT-132-02-H-D-BE-A-K LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SQT-150-02-S-T CONN RCPT 150POS 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	SQT	Tube	Active	Receptacle	Forked	Board to Board or Cable	150	All	0.079" (2.00mm)	3	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.250" (6.35mm)	0.600" (15.24mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-	-	5.1A per Contact	-
CLT-149-02-LM-D-BE-A LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CLT-135-02-H-D-A-P LOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ESQT-140-02-G-Q-335 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.335" (8.51mm)	0.515" (13.08mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-338 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.338" (8.59mm)	0.512" (13.00mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-500 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.500" (12.70mm)	0.350" (8.89mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-530 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.530" (13.46mm)	0.320" (8.13mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-538 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.538" (13.67mm)	0.312" (7.93mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-563 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.563" (14.30mm)	0.287" (7.29mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-576 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.576" (14.63mm)	0.274" (6.96mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-650 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.650" (16.50mm)	0.200" (5.08mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-670 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.670" (17.02mm)	0.180" (4.57mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-680 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.680" (17.27mm)	0.170" (4.32mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-
ESQT-140-02-G-Q-711 CONN SOCKET 160P 0.079 GOLD PCB Samtec Inc.	-	RFQ	-	ESQT	Tube	Active	Elevated Socket	Forked	Board to Board or Cable	160	All	0.079" (2.00mm)	4	0.079" (2.00mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.711" (18.06mm)	0.139" (3.53mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	4.5A per Contact	-