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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
01-0508-20 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
01-0508-30 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
AW 127-30/Z-T SOCKET 30 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	برگه مشخصات	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AJ 28-LC SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
116-87-304-41-011101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
PRT-07939 DIP SOCKETS SOLDER TAIL - 14-PIN SparkFun Electronics	-	RFQ	-	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	-	-	-	-	Through Hole	Open Frame	Solder	-	-	-	-	-	-
PRT-07938 DIP SOCKETS SOLDER TAIL - 16-PIN SparkFun Electronics	-	RFQ	-	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	-	-	-	-	Through Hole	Open Frame	Solder	-	-	-	-	-	-
HLS-0103-TT-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	برگه مشخصات	HLS	Tube	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
110-87-314-41-605101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR28-HZL-TT CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	-	RFQ	برگه مشخصات	-	Bag	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
A-CCS20-Z-R CONN SOCKET PLCC 20POS TIN Assmann WSW Components	-	RFQ	برگه مشخصات	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
115-83-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-304-41-008101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
05-0518-10H CONN SOCKET SIP 5POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
06-1518-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
04-0513-10T CONN SOCKET SIP 4POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	0513	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
808-AG11D-ES CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
SBU130Z CONN SOCKET SIP 13POS GOLD On Shore Technology Inc.	-	RFQ	برگه مشخصات	SBU	Bulk	Active	SIP	13 (1 x 13)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
02-0513-11 CONN SOCKET SIP 2POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	0513	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-83-306-41-105101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C