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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
AR 16 HGL-TT

AR 16 HGL-TT

SOCKET

Assmann WSW Components

0
RFQ
AR 16 HGL-TT

برگه مشخصات

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
940-99-068-24-000000

940-99-068-24-000000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
940-99-068-24-000000

برگه مشخصات

940 Tube Obsolete PLCC 68 (4 x 17) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-87-308-41-001101

612-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0
RFQ
612-87-308-41-001101

برگه مشخصات

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP316-014B

DIP316-014B

DIP SOCKET 16 CTS

Amphenol ICC (FCI)

0
RFQ
DIP316-014B

برگه مشخصات

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
115-87-310-41-001101

115-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 36-HZL-TT

AR 36-HZL-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS52-Z-SM

A-CCS52-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0
RFQ
A-CCS52-Z-SM

برگه مشخصات

- Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
940-99-028-17-400000

940-99-028-17-400000

CONN SOCKET PLCC 28POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
940-99-028-17-400000

برگه مشخصات

940 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A14-LCG-T-R

A14-LCG-T-R

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

0
RFQ
A14-LCG-T-R

برگه مشخصات

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
DIP320-011B

DIP320-011B

DIP320-011B-DIP SOCKET 20 CTS

Amphenol ICC (FCI)

0
RFQ
DIP320-011B

برگه مشخصات

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
540-88-032-17-400-2

540-88-032-17-400-2

CONN SOCKET PLCC 32POS TIN

Preci-Dip

0
RFQ
540-88-032-17-400-2

برگه مشخصات

540 Bulk Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
AW 127-25/Z-T

AW 127-25/Z-T

SOCKET 25 CONTACTS SINGLE ROW

Assmann WSW Components

0
RFQ
AW 127-25/Z-T

برگه مشخصات

- - Active - - - - - - - - - - - - - - -
822475-2

822475-2

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors

0
RFQ
822475-2

برگه مشخصات

- Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -
4842-6004-CP

4842-6004-CP

CONN IC DIP SOCKET 42POS TIN

3M

0
RFQ

-

4800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
AR24-HZL-TT

AR24-HZL-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

0
RFQ
AR24-HZL-TT

برگه مشخصات

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0
RFQ
04-1518-00

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0
RFQ
02-0518-11H

برگه مشخصات

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0
RFQ
02-1518-11H

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-83-304-41-035101

146-83-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0
RFQ
146-83-304-41-035101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-304-41-036101

146-83-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0
RFQ
146-83-304-41-036101

برگه مشخصات

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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