سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
AR 20-HZL/01-TT SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
146-83-306-41-035101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	146	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
146-83-306-41-036101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	146	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1052000001 SMIA55 CAMERA SOCKET BOTTOM CONT Molex	-	RFQ	برگه مشخصات	105200	Tray	Obsolete	Camera Socket	12 (2 x 6)	0.028" (0.70mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount, Through Board	Open Frame	Solder	0.028" (0.70mm)	Gold	Flash	Copper Alloy	Thermoplastic	-55°C ~ 85°C
410-87-216-10-001101 CONN ZIG-ZAG 16POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	410	Bulk	Active	Zig-Zag, Left Stackable	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
410-87-216-10-002101 CONN ZIG-ZAG 16POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	410	Bulk	Active	Zig-Zag, Right Stackable	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-308-41-018101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-210-41-117101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	114	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-316-01-822101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8), 4 Loaded	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
122-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	122	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-312-41-006101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
510-87-025-05-000101 CONN SOCKET PGA 25POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	25 (5 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-87-316-41-117101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS068-Z-SM/P SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	PLCC	68	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
146-87-308-41-035101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	146	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
146-87-308-41-036101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	146	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-308-41-008101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
540-99-020-24-000000 CONN SOCKET PLCC 20POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	540	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin-Lead	200.0µin (5.08µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)	-
SIP050-1X12-157B 1X12-157B-SIP SOCKET 12 CTS Amphenol ICC (FCI)	-	RFQ	برگه مشخصات	SIP050-1x	Bulk	Active	SIP	12 (1 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
AW127-20/Z-T-R SOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	برگه مشخصات	-	Bulk	Obsolete	-	20 (1 x 20)	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Brass	Through Hole	-	Solder	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C