سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
110-83-308-41-105161 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AJ 52-LC SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
1051990001 CONN CAM SOCKET 34POS GOLD Molex	-	RFQ	برگه مشخصات	105199	Tape & Reel (TR)	Obsolete	Camera Socket	34 (2 x 8, 2 x 9)	0.024" (0.60mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.024" (0.60mm)	-	-	Copper Alloy	Plastic	-30°C ~ 85°C
06-3518-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
08-0518-10H CONN SOCKET SIP 8POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	SIP	8 (1 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
115-87-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-420-41-005101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
2-641602-4 CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	Diplomate DL	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Thermoplastic	-55°C ~ 125°C
917-83-104-41-005101 CONN TRANSIST TO-5 4POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	917	Bulk	Active	Transistor, TO-5	4 (Round)	-	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-210-01-742101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5), 6 Loaded	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
231-44 CONN SOCKET PLCC 44POS GOLD CNC Tech	-	RFQ	برگه مشخصات	-	Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
06-3513-10T CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
A-CCS20-G-R CONN SOCKET PLCC 20POS GOLD Assmann WSW Components	-	RFQ	برگه مشخصات	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
AR24-HZL/7/01-TT CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	-	RFQ	-	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
SIP050-1X11-160B 1X11-160B-SIP SOCKET 11 CTS Amphenol ICC (FCI)	-	RFQ	برگه مشخصات	SIP050-1x	Bulk	Active	SIP	11 (1 x 11)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
AR 42-HGL-TT SOCKET Assmann WSW Components	-	RFQ	-	AR	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
822473-4 CONN SOCKET PLCC 44POS TIN-LEAD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	-	Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Thermoplastic	-
115-87-318-41-001101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-83-312-41-005101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-312-41-018101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C