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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
SIP050-1X20-157B

SIP050-1X20-157B

1X20-157B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X20-157B

برگه مشخصات

SIP050-1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X32-011B

SIP1X32-011B

SIP1X32-011B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0
RFQ
SIP1X32-011B

برگه مشخصات

SIP1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
AR24-HZW/T

AR24-HZW/T

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0
RFQ
AR24-HZW/T

برگه مشخصات

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A 24-LC-TR01

A 24-LC-TR01

24 (2 X 12) POS DIP, 0.3" (7.62M

Assmann WSW Components

0
RFQ
A 24-LC-TR01

برگه مشخصات

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
116-87-210-41-007101

116-87-210-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
116-87-210-41-007101

برگه مشخصات

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-424-41-003101

115-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
115-87-424-41-003101

برگه مشخصات

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-312-41-003101

116-83-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
116-83-312-41-003101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-322-41-003101

115-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
115-87-322-41-003101

برگه مشخصات

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-320-41-105101

110-87-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
110-87-320-41-105101

برگه مشخصات

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-420-41-001101

614-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
614-87-420-41-001101

برگه مشخصات

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-3513-10T

14-3513-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0
RFQ
14-3513-10T

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-314-41-001101

614-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
614-83-314-41-001101

برگه مشخصات

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X18-157B

SIP050-1X18-157B

1X18-157B-SIP SOCKET 18 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X18-157B

برگه مشخصات

SIP050-1x Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
03-0503-20

03-0503-20

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0
RFQ
03-0503-20

برگه مشخصات

0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
03-0503-30

03-0503-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0
RFQ
03-0503-30

برگه مشخصات

0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
AR32-HZL/01-TT

AR32-HZL/01-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

0
RFQ
AR32-HZL/01-TT

برگه مشخصات

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
SMPX-28LCC-P

SMPX-28LCC-P

SMT PLCC SOCKET 28P POLARISED RO

Kycon, Inc.

0
RFQ
SMPX-28LCC-P

برگه مشخصات

SMPX Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
SMPX-32LCC-P

SMPX-32LCC-P

SMT PLCC SOCKET 32P POLARISED RO

Kycon, Inc.

0
RFQ
SMPX-32LCC-P

برگه مشخصات

SMPX Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
114-87-624-41-117101

114-87-624-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
114-87-624-41-117101

برگه مشخصات

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
BU-20OZ

BU-20OZ

CONN IC DIP SOCKET 20POS

On Shore Technology Inc.

0
RFQ

-

BU Tube Active - 20 (2 x 10) - - - - - - - - - - - - -
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