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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
110-83-318-41-605101

110-83-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
110-83-318-41-605101

برگه مشخصات

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-310-41-001101

121-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
121-83-310-41-001101

برگه مشخصات

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
130-024-050

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M

0
RFQ
130-024-050

برگه مشخصات

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
110-83-320-41-001151

110-83-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ

-

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-314-41-134191

114-83-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
114-83-314-41-134191

برگه مشخصات

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0513-11

05-0513-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0
RFQ
05-0513-11

برگه مشخصات

0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP050-1X16-160B

SIP050-1X16-160B

1X16-160B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X16-160B

برگه مشخصات

SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
917-87-108-41-053101

917-87-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0
RFQ
917-87-108-41-053101

برگه مشخصات

917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-87-208-41-053101

917-87-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0
RFQ
917-87-208-41-053101

برگه مشخصات

917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 64-HGL-TT

AR 64-HGL-TT

SOCKET

Assmann WSW Components

0
RFQ

-

AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
814-AG11D-ES

814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0
RFQ
814-AG11D-ES

برگه مشخصات

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
410-83-216-10-001101

410-83-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0
RFQ
410-83-216-10-001101

برگه مشخصات

410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-83-216-10-002101

410-83-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0
RFQ
410-83-216-10-002101

برگه مشخصات

410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
11-0513-10

11-0513-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0
RFQ
11-0513-10

برگه مشخصات

0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-0513-10T

12-0513-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0
RFQ
12-0513-10T

برگه مشخصات

0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0503-21

02-0503-21

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0
RFQ
02-0503-21

برگه مشخصات

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
02-0503-31

02-0503-31

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0
RFQ
02-0503-31

برگه مشخصات

0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
06-0518-11H

06-0518-11H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0
RFQ
06-0518-11H

برگه مشخصات

518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-1518-11H

06-1518-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0
RFQ
06-1518-11H

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
13-0518-10H

13-0518-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0
RFQ
13-0518-10H

برگه مشخصات

518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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