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| عکس | شماره قطعه تولیدکننده | موجودی | تعداد | برگه مشخصات | سری | بسته بندی | وضعیت محصول | تایپ کنید | تعداد موقعیت ها یا پین ها (شبکه) | زمین - جفت گیری | تماس با پایان - جفت گیری | ضخامت پایان تماس - جفت گیری | مواد تماس - جفت گیری | نوع نصب | ویژگی ها | فسخ | زمین - پست | تماس با پایان - ارسال | تماس با ضخامت پایان - پست | تماس با مواد - پست | مصالح مسکن | دمای عملیاتی |
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614-87-422-31-012101CONN IC DIP SOCKET 22POS GOLD |
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برگه مشخصات |
614 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-87-308-41-013101CONN IC DIP SOCKET 8POS GOLD |
0 |
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برگه مشخصات |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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APH-0502-T-TAPH-0502-T-T |
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APH-1002-T-TAPH-1002-T-T |
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APH-1502-T-TAPH-1502-T-T |
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APH-1902-T-TAPH-1902-T-T |
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APH-0602-T-TAPH-0602-T-T |
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APH-1102-T-TAPH-1102-T-T |
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APH-1602-T-TAPH-1602-T-T |
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APH-0202-T-TAPH-0202-T-T |
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APH-0302-T-TAPH-0302-T-T |
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APH-0702-T-TAPH-0702-T-T |
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APH-0402-T-TAPH-0402-T-T |
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APH-1802-T-TAPH-1802-T-T |
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APH-1302-T-TAPH-1302-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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614-83-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
0 |
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برگه مشخصات |
614 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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614-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
0 |
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برگه مشخصات |
614 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-87-324-41-003101CONN IC DIP SOCKET 24POS GOLD |
0 |
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برگه مشخصات |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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110-83-316-41-105191CONN IC DIP SOCKET 16POS GOLD |
0 |
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110 | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-83-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
0 |
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برگه مشخصات |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
