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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
116-83-314-41-002101

116-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
116-83-314-41-002101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-428-41-001101

110-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
RFQ
110-83-428-41-001101

برگه مشخصات

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-0513-10

16-0513-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0
RFQ
16-0513-10

برگه مشخصات

0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0518-10H

19-0518-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0
RFQ
19-0518-10H

برگه مشخصات

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-87-320-41-001101

123-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
123-87-320-41-001101

برگه مشخصات

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D95022-42

D95022-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

0
RFQ
D95022-42

برگه مشخصات

D95 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-424-41-018101

116-87-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
116-87-424-41-018101

برگه مشخصات

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-318-41-001101

612-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
612-83-318-41-001101

برگه مشخصات

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-314-STL-O-TR

ICF-314-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0
RFQ
ICF-314-STL-O-TR

برگه مشخصات

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
BU180Z-178-HT

BU180Z-178-HT

CONN IC DIP SOCKET 18POS GOLD

On Shore Technology Inc.

0
RFQ
BU180Z-178-HT

برگه مشخصات

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
614-87-624-31-012101

614-87-624-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ
614-87-624-31-012101

برگه مشخصات

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-011101

116-87-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
RFQ
116-87-314-41-011101

برگه مشخصات

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-004101

116-87-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0
RFQ
116-87-312-41-004101

برگه مشخصات

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-43-105-41-013000

346-43-105-41-013000

CONN SOCKET SIP 5POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
346-43-105-41-013000

برگه مشخصات

346 Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-314-ZSTT

ICA-314-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-314-ZSTT

برگه مشخصات

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
110-83-320-41-105101

110-83-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
RFQ
110-83-320-41-105101

برگه مشخصات

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-422-41-117101

114-83-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
114-83-422-41-117101

برگه مشخصات

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
12-0513-10

12-0513-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0
RFQ
12-0513-10

برگه مشخصات

0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0108-S-2

HLS-0108-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0108-S-2

برگه مشخصات

HLS Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-87-642-41-005101

110-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0
RFQ
110-87-642-41-005101

برگه مشخصات

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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